[{"data":1,"prerenderedAt":47},["ShallowReactive",2],{"blog-frequency-response-pcb-material-cn":3},{"title":4,"description":5,"date":6,"lastUpdated":6,"category":7,"image":8,"readingTime":9,"wordCount":10,"timeRequired":11,"htmlContent":12,"faq":13,"tags":14,"slug":21,"sourceLocale":22,"jsonld":23},"Frequency Response of PCB Material: Wideband Characterization and Performance","Complete guide to frequency response of PCB materials covering frequency-dependent Dk and Df, dispersion effects, wideband design considerations, and material characterization methods.","2025-08-20","materials","/assets/img/blogs/2025/08/frequency-response-pcb-material.webp",8,1440,"PT8M","\u003Cp>PCB material properties vary with frequency—dielectric constant decreases, loss tangent may change, and propagation characteristics shift across the spectrum. For wideband applications spanning multiple octaves or requiring consistent performance from DC to daylight, understanding material frequency response is essential for successful design.\u003C/p>\n\u003Cp>This guide provides comprehensive knowledge of frequency-dependent material behavior and its implications for \u003Ca href=\"/cn/blog/high-frequency-pcb-material-performance/\">HF PCB material performance\u003C/a> in wideband applications.\u003C/p>\n\u003Cp>HILPCB offers materials characterized across wide frequency ranges, with engineering support for selecting materials that meet your wideband requirements for \u003Ca href=\"/cn/products/high-frequency-pcb/\">RF and microwave circuit fabrication\u003C/a>.\u003C/p>\n\u003Ch2>Frequency Dependence of Dielectric Constant\u003C/h2>\n\u003Cp>Dielectric constant (Dk) varies with frequency due to the time required for molecular polarization to respond to changing electric fields. This variation affects impedance, velocity, and wavelength across the operating bandwidth.\u003C/p>\n\u003Cp>At HILPCB, we provide frequency-characterized material data to support accurate wideband design.\u003C/p>\n\u003Cp>\u003Cstrong>Polarization Mechanisms\u003C/strong>\u003C/p>\n\u003Cp>Different polarization mechanisms dominate at different frequencies:\u003C/p>\n\u003Cul>\n\u003Cli>\u003Cstrong>Electronic polarization:\u003C/strong> Fastest, active to optical frequencies\u003C/li>\n\u003Cli>\u003Cstrong>Ionic polarization:\u003C/strong> Slower, contributes below ~THz\u003C/li>\n\u003Cli>\u003Cstrong>Dipolar polarization:\u003C/strong> Much slower, contributes to MHz-GHz\u003C/li>\n\u003Cli>\u003Cstrong>Interfacial polarization:\u003C/strong> Slowest, low-frequency effect\u003C/li>\n\u003C/ul>\n\u003Cp>As frequency increases, slower mechanisms can't follow the field, and Dk decreases.\u003C/p>\n\u003Cp>\u003Cstrong>Typical Dk Frequency Behavior\u003C/strong>\u003C/p>\n\u003Cp>Most PCB materials show decreasing Dk with increasing frequency:\u003C/p>\n\u003Ctable>\n\u003Cthead>\n\u003Ctr>\n\u003Cth>Material\u003C/th>\n\u003Cth>Dk @ 1 MHz\u003C/th>\n\u003Cth>Dk @ 1 GHz\u003C/th>\n\u003Cth>Dk @ 10 GHz\u003C/th>\n\u003C/tr>\n\u003C/thead>\n\u003Ctbody>\u003Ctr>\n\u003Ctd>Standard FR-4\u003C/td>\n\u003Ctd>4.7\u003C/td>\n\u003Ctd>4.4\u003C/td>\n\u003Ctd>4.0\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Low-loss FR-4\u003C/td>\n\u003Ctd>4.0\u003C/td>\n\u003Ctd>3.8\u003C/td>\n\u003Ctd>3.6\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Rogers RO4350B\u003C/td>\n\u003Ctd>3.66\u003C/td>\n\u003Ctd>3.52\u003C/td>\n\u003Ctd>3.48\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>PTFE\u003C/td>\n\u003Ctd>2.20\u003C/td>\n\u003Ctd>2.18\u003C/td>\n\u003Ctd>2.17\u003C/td>\n\u003C/tr>\n\u003C/tbody>\u003C/table>\n\u003Cp>PTFE and ceramic-filled materials show the most stable Dk across frequency.\u003C/p>\n\u003Cp>\u003Cstrong>Impedance Variation\u003C/strong>\u003C/p>\n\u003Cp>Frequency-dependent Dk causes frequency-dependent impedance:\u003C/p>\n\u003Cul>\n\u003Cli>Higher frequency sees lower Dk\u003C/li>\n\u003Cli>Lower Dk means higher impedance for same geometry\u003C/li>\n\u003Cli>Wideband signals experience different impedance at different frequencies\u003C/li>\n\u003C/ul>\n\u003Cp>For 10% Dk variation: ~5% impedance variation across bandwidth.\u003C/p>\n\u003Cp>\u003Cstrong>Design Implications\u003C/strong>\u003C/p>\n\u003Cp>For wideband designs:\u003C/p>\n\u003Cul>\n\u003Cli>Use materials with stable Dk (PTFE, ceramic-filled)\u003C/li>\n\u003Cli>Characterize material at center frequency\u003C/li>\n\u003Cli>Account for impedance variation in margin analysis\u003C/li>\n\u003Cli>Consider frequency-dependent matching\u003C/li>\n\u003C/ul>\n\u003Ch2>Frequency Dependence of Loss\u003C/h2>\n\u003Cp>Loss tangent (Df) also varies with frequency, though the pattern differs by material type. Understanding this variation enables accurate loss prediction across bandwidth.\u003C/p>\n\u003Cp>For wideband low-loss requirements, HILPCB offers \u003Ca href=\"/cn/products/teflon-pcb/\">fluoropolymer laminates\u003C/a> with stable loss characteristics.\u003C/p>\n\u003Cp>\u003Cstrong>Loss Mechanisms by Frequency\u003C/strong>\u003C/p>\n\u003Cul>\n\u003Cli>\u003Cstrong>Conduction loss:\u003C/strong> Present at all frequencies, DC component\u003C/li>\n\u003Cli>\u003Cstrong>Polarization loss:\u003C/strong> Peaks at relaxation frequencies\u003C/li>\n\u003Cli>\u003Cstrong>Resonance loss:\u003C/strong> Material-specific resonances\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Material-Specific Behavior\u003C/strong>\u003C/p>\n\u003Cp>Different materials show different Df trends:\u003C/p>\n\u003Cul>\n\u003Cli>\u003Cstrong>FR-4:\u003C/strong> Df generally increases with frequency (relaxation effects)\u003C/li>\n\u003Cli>\u003Cstrong>PTFE:\u003C/strong> Df relatively flat or slightly decreasing\u003C/li>\n\u003Cli>\u003Cstrong>Ceramic-filled:\u003C/strong> Generally stable across frequency\u003C/li>\n\u003C/ul>\n\u003Cdiv style=\"background: linear-gradient(135deg, #1e3a5f 0%, #2d5a87 100%); border-radius: 20px; padding: 32px 24px; margin: 32px 0; box-shadow: 0 12px 32px rgba(0,0,0,0.3);\">\n\u003Ch3 style=\"color: #e0f2fe; font-size: 17px; font-weight: 700; margin: 0 0 24px 0; text-align: center;\">Dk Stability Across Frequency\u003C/h3>\n\u003Cdiv style=\"display: grid; grid-template-columns: repeat(2, 1fr); gap: 16px;\">\n\u003Cdiv style=\"background: rgba(255,255,255,0.1); border-radius: 10px; padding: 20px 14px; text-align: center;\">\n\u003Cdiv style=\"font-size: 22px; font-weight: 800; color: #7dd3fc;\">FR-4\u003C/div>\n\u003Cdiv style=\"font-size: 12px; color: #bae6fd; margin-top: 6px;\">10-15% Dk variation (1 MHz - 10 GHz)\u003C/div>\n\u003C/div>\n\u003Cdiv style=\"background: rgba(255,255,255,0.1); border-radius: 10px; padding: 20px 14px; text-align: center;\">\n\u003Cdiv style=\"font-size: 22px; font-weight: 800; color: #7dd3fc;\">Low-Loss\u003C/div>\n\u003Cdiv style=\"font-size: 12px; color: #bae6fd; margin-top: 6px;\">5-8% Dk variation\u003C/div>\n\u003C/div>\n\u003Cdiv style=\"background: rgba(255,255,255,0.1); border-radius: 10px; padding: 20px 14px; text-align: center;\">\n\u003Cdiv style=\"font-size: 22px; font-weight: 800; color: #7dd3fc;\">Rogers\u003C/div>\n\u003Cdiv style=\"font-size: 12px; color: #bae6fd; margin-top: 6px;\">3-5% Dk variation\u003C/div>\n\u003C/div>\n\u003Cdiv style=\"background: rgba(255,255,255,0.1); border-radius: 10px; padding: 20px 14px; text-align: center;\">\n\u003Cdiv style=\"font-size: 22px; font-weight: 800; color: #7dd3fc;\">PTFE\u003C/div>\n\u003Cdiv style=\"font-size: 12px; color: #bae6fd; margin-top: 6px;\"><2% Dk variation\u003C/div>\n\u003C/div>\n\u003C/div>\n\u003C/div>\n\n\u003Cp>\u003Cstrong>Total Loss Frequency Dependence\u003C/strong>\u003C/p>\n\u003Cp>Total transmission line loss combines:\u003C/p>\n\u003Cul>\n\u003Cli>Conductor loss: Increases with √f\u003C/li>\n\u003Cli>Dielectric loss: Increases approximately linearly with f\u003C/li>\n\u003C/ul>\n\u003Cp>At low frequencies, conductor loss dominates. At high frequencies, dielectric loss dominates. Crossover frequency depends on material and geometry.\u003C/p>\n\u003Cp>\u003Cstrong>Wideband Loss Estimation\u003C/strong>\u003C/p>\n\u003Cp>For accurate wideband loss prediction:\u003C/p>\n\u003Cul>\n\u003Cli>Use frequency-specific Df values\u003C/li>\n\u003Cli>Calculate loss at multiple frequencies\u003C/li>\n\u003Cli>Consider both conductor and dielectric contributions\u003C/li>\n\u003Cli>Account for dispersion in pulse response\u003C/li>\n\u003C/ul>\n\u003Ch2>Dispersion and Signal Distortion\u003C/h2>\n\u003Cp>When propagation velocity varies with frequency (due to Dk frequency dependence), signals disperse—different frequency components travel at different speeds, causing pulse spreading and distortion.\u003C/p>\n\u003Cp>Understanding dispersion: \u003Ca href=\"/cn/blog/dielectric-properties-hf-pcb/\">Dielectric Properties of HF PCB\u003C/a>\u003C/p>\n\u003Cp>\u003Cstrong>Dispersion Mechanism\u003C/strong>\u003C/p>\n\u003Cp>Phase velocity in transmission line:\u003C/p>\n\u003Cp>v_p = c / √Dk_eff\u003C/p>\n\u003Cp>If Dk varies with frequency, v_p varies, causing:\u003C/p>\n\u003Cul>\n\u003Cli>Different frequency components arrive at different times\u003C/li>\n\u003Cli>Sharp pulse edges spread\u003C/li>\n\u003Cli>Pre-shoot and post-shoot on waveforms\u003C/li>\n\u003Cli>Increased inter-symbol interference\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Group Delay Variation\u003C/strong>\u003C/p>\n\u003Cp>Group delay measures how fast signal envelope propagates:\u003C/p>\n\u003Cp>τ_g = -dφ/dω\u003C/p>\n\u003Cp>Frequency-dependent Dk causes group delay variation across bandwidth. This variation indicates dispersion severity.\u003C/p>\n\u003Cp>\u003Cstrong>Impact on Digital Signals\u003C/strong>\u003C/p>\n\u003Cp>Wideband digital signals contain many harmonics. Dispersion:\u003C/p>\n\u003Cul>\n\u003Cli>Rounds pulse edges\u003C/li>\n\u003Cli>Reduces eye opening\u003C/li>\n\u003Cli>Increases jitter\u003C/li>\n\u003Cli>Worsens ISI\u003C/li>\n\u003C/ul>\n\u003Cp>Fast rise time signals are most affected.\u003C/p>\n\u003Cp>\u003Cstrong>Minimizing Dispersion\u003C/strong>\u003C/p>\n\u003Cp>For minimum dispersion:\u003C/p>\n\u003Cul>\n\u003Cli>Select materials with stable Dk (PTFE, ceramic)\u003C/li>\n\u003Cli>Use shorter traces (less time for spreading)\u003C/li>\n\u003Cli>Consider equalization to compensate\u003C/li>\n\u003Cli>Design for achievable rather than ideal rise times\u003C/li>\n\u003C/ul>\n\u003Ch2>Wideband Design Considerations\u003C/h2>\n\u003Cp>Practical approaches to designing circuits that operate across wide frequency ranges.\u003C/p>\n\u003Cp>For wideband applications, HILPCB provides \u003Ca href=\"/cn/pcb-manufacturing/\">precision RF PCB manufacturing\u003C/a> with characterized materials.\u003C/p>\n\u003Cp>\u003Cstrong>Material Selection Criteria\u003C/strong>\u003C/p>\n\u003Cp>For wideband applications, prioritize:\u003C/p>\n\u003Col>\n\u003Cli>Dk stability across frequency (minimize dispersion)\u003C/li>\n\u003Cli>Low Df across entire bandwidth (minimize loss variation)\u003C/li>\n\u003Cli>Dk tolerance (consistent impedance)\u003C/li>\n\u003Cli>Temperature stability (consistent across operating range)\u003C/li>\n\u003C/ol>\n\u003Cp>\u003Cstrong>Impedance Matching Bandwidth\u003C/strong>\u003C/p>\n\u003Cp>Wideband matching challenges:\u003C/p>\n\u003Cul>\n\u003Cli>Component values are frequency-dependent\u003C/li>\n\u003Cli>Transmission line matching varies with Dk\u003C/li>\n\u003Cli>Lumped element matching has bandwidth limits\u003C/li>\n\u003C/ul>\n\u003Cp>Strategies:\u003C/p>\n\u003Cul>\n\u003Cli>Use distributed matching for wider bandwidth\u003C/li>\n\u003Cli>Account for Dk variation in matching network design\u003C/li>\n\u003Cli>Consider tapered transitions for very wideband\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Transition Structures\u003C/strong>\u003C/p>\n\u003Cp>Wideband transitions (connectors, vias) require careful design:\u003C/p>\n\u003Cul>\n\u003Cli>Minimize discontinuity at all frequencies\u003C/li>\n\u003Cli>Via compensation may need to be frequency-weighted\u003C/li>\n\u003Cli>Connector launch optimization for bandwidth\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Simulation Approach\u003C/strong>\u003C/p>\n\u003Cp>For accurate wideband simulation:\u003C/p>\n\u003Cul>\n\u003Cli>Use frequency-dependent material models\u003C/li>\n\u003Cli>Include skin effect conductor models\u003C/li>\n\u003Cli>Simulate across entire bandwidth of interest\u003C/li>\n\u003Cli>Verify with frequency-domain measurements\u003C/li>\n\u003C/ul>\n\u003Ch2>Material Characterization Methods\u003C/h2>\n\u003Cp>Accurate characterization provides the data needed for precise wideband design.\u003C/p>\n\u003Cp>HILPCB works with characterized materials and can provide data sheets with frequency-dependent properties.\u003C/p>\n\u003Cp>\u003Cstrong>Resonant Methods\u003C/strong>\u003C/p>\n\u003Cp>Split-post dielectric resonator:\u003C/p>\n\u003Cul>\n\u003Cli>High accuracy at discrete frequencies\u003C/li>\n\u003Cli>Measures Dk and Df simultaneously\u003C/li>\n\u003Cli>Standard method (IPC-TM-650 2.5.5.13)\u003C/li>\n\u003Cli>Typical frequencies: 1-20 GHz\u003C/li>\n\u003C/ul>\n\u003Cp>Cavity resonator:\u003C/p>\n\u003Cul>\n\u003Cli>Very high accuracy\u003C/li>\n\u003Cli>Single frequency per cavity\u003C/li>\n\u003Cli>Reference method for material qualification\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Transmission Line Methods\u003C/strong>\u003C/p>\n\u003Cp>Microstrip or stripline test structures:\u003C/p>\n\u003Cul>\n\u003Cli>Broadband measurement possible\u003C/li>\n\u003Cli>Requires accurate fixture calibration\u003C/li>\n\u003Cli>Extracts Dk and Df from S-parameters\u003C/li>\n\u003Cli>Practical for production verification\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Full-Wave Extraction\u003C/strong>\u003C/p>\n\u003Cp>From S-parameter measurements:\u003C/p>\n\u003Cul>\n\u003Cli>Measure test structure with VNA\u003C/li>\n\u003Cli>De-embed fixture effects\u003C/li>\n\u003Cli>Extract material parameters using models\u003C/li>\n\u003Cli>Provides broadband Dk and Df curves\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Data Sheet Interpretation\u003C/strong>\u003C/p>\n\u003Cp>Material data sheets may specify:\u003C/p>\n\u003Cul>\n\u003Cli>Dk at single frequency (often 10 GHz)\u003C/li>\n\u003Cli>Dk at multiple frequencies (better)\u003C/li>\n\u003Cli>Dk tolerance\u003C/li>\n\u003Cli>Df at single or multiple frequencies\u003C/li>\n\u003C/ul>\n\u003Cp>For wideband design, request multi-frequency data or use published curves.\u003C/p>\n\u003Ch2>Material Options for Wideband Applications\u003C/h2>\n\u003Cp>Materials optimized for wideband performance.\u003C/p>\n\u003Cp>HILPCB stocks wideband-suitable materials including \u003Ca href=\"/cn/products/rogers-pcb/\">Rogers high-frequency laminates\u003C/a>.\u003C/p>\n\u003Cp>\u003Cstrong>PTFE-Based Materials\u003C/strong>\u003C/p>\n\u003Cp>Best Dk stability for wideband:\u003C/p>\n\u003Cul>\n\u003Cli>Rogers RT/duroid 5880: Dk 2.20, very stable\u003C/li>\n\u003Cli>Taconic TLY: Dk 2.2, excellent stability\u003C/li>\n\u003Cli>Arlon DiClad: Dk 2.5, good stability\u003C/li>\n\u003C/ul>\n\u003Cp>Challenges: Special processing, higher cost\u003C/p>\n\u003Cp>\u003Cstrong>Ceramic-Filled Hydrocarbon\u003C/strong>\u003C/p>\n\u003Cp>Good stability with easier processing:\u003C/p>\n\u003Cul>\n\u003Cli>Rogers RO4350B: Dk 3.48, good stability\u003C/li>\n\u003Cli>Rogers RO4003C: Dk 3.55, similar performance\u003C/li>\n\u003Cli>Isola Astra: Dk 3.0, low-loss ceramic\u003C/li>\n\u003C/ul>\n\u003Cp>FR-4 compatible processing, moderate cost.\u003C/p>\n\u003Cp>\u003Cstrong>Low-Loss FR-4 Variants\u003C/strong>\u003C/p>\n\u003Cp>For cost-sensitive wideband (up to ~10 GHz):\u003C/p>\n\u003Cul>\n\u003Cli>Panasonic Megtron 6: Good stability\u003C/li>\n\u003Cli>Isola I-Tera MT40: Moderate stability\u003C/li>\n\u003Cli>Various vendor options\u003C/li>\n\u003C/ul>\n\u003Cp>Standard processing, lowest HF material cost.\u003C/p>\n\u003Chr>\n\u003Ch2>Related Material Performance Topics\u003C/h2>\n\u003Cul>\n\u003Cli>\u003Cstrong>\u003Ca href=\"/cn/blog/high-frequency-pcb-material-performance/\">High Frequency PCB Material Performance\u003C/a>:\u003C/strong> Complete material selection guide\u003C/li>\n\u003Cli>\u003Cstrong>\u003Ca href=\"/cn/blog/dielectric-properties-hf-pcb/\">Dielectric Properties of HF PCB\u003C/a>:\u003C/strong> Dk and Df fundamentals\u003C/li>\n\u003Cli>\u003Cstrong>\u003Ca href=\"/cn/blog/material-loss-factor-hf-pcb/\">Material Loss Factor in HF PCB\u003C/a>:\u003C/strong> Loss mechanisms\u003C/li>\n\u003Cli>\u003Cstrong>\u003Ca href=\"/cn/blog/thermal-stability-high-frequency-pcb/\">Thermal Stability in High Frequency PCB\u003C/a>:\u003C/strong> Temperature effects\u003C/li>\n\u003Cli>\u003Cstrong>\u003Ca href=\"/cn/blog/moisture-effect-hf-pcb-material/\">Moisture Effects on HF PCB Material\u003C/a>:\u003C/strong> Humidity impacts\u003C/li>\n\u003C/ul>\n\u003Cdiv data-component=\"BlogQuickQuoteInline\">\u003C/div>\n\n\u003Chr>\n\u003Ch2>HILPCB Wideband Material Services\u003C/h2>\n\u003Cp>HILPCB delivers materials for wideband high frequency applications:\u003C/p>\n\u003Cp>\u003Cstrong>Characterized Materials:\u003C/strong> Materials with documented frequency response data for accurate wideband design.\u003C/p>\n\u003Cp>\u003Cstrong>Material Selection Support:\u003C/strong> Engineering consultation for selecting materials meeting your bandwidth and stability requirements.\u003C/p>\n\u003Cp>\u003Cstrong>Process Control:\u003C/strong> Consistent manufacturing that preserves characterized material properties.\u003C/p>\n\u003Cp>\u003Cstrong>Verification:\u003C/strong> S-parameter testing available to verify wideband performance meets requirements.\u003C/p>\n\u003Cp>From \u003Ca href=\"/cn/products/small-batch-assembly/\">prototype wideband circuits\u003C/a> through \u003Ca href=\"/cn/products/large-volume-assembly/\">production volumes\u003C/a>, HILPCB provides frequency-stable materials for demanding wideband applications.\u003C/p>\n\u003Cp>Contact HILPCB for wideband material consultation and manufacturing quotation.\u003C/p>\n\n\u003Csection class=\"related-links\" aria-label=\"Related\">\u003Ch3>Related links\u003C/h3>\u003Cul>\u003Cli>\u003Ca href=\"/cn/blog/high-frequency-pcb-material-performance/\">High Frequency PCB Material Performance: Complete Selection and Analysis Guide\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/cn/products/high-frequency-pcb/\">RF and microwave circuit fabrication\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/cn/products/teflon-pcb/\">fluoropolymer laminates\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/cn/blog/dielectric-properties-hf-pcb/\">PCB材料介电常数 (Dk)：定义、单位、计算公式与损耗角正切 (Df)\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/cn/pcb-manufacturing/\">precision RF PCB manufacturing\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/cn/products/rogers-pcb/\">Rogers high-frequency laminates\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/cn/blog/material-loss-factor-hf-pcb/\">Material Loss Factor in HF PCB: Understanding and Minimizing Signal Attenuation\u003C/a>\u003C/li>\u003C/ul>\u003C/section>",[],[15,16,17,18,19,20],"Frequency Response","PCB Material","Wideband Design","Dispersion","Material Characterization","High Frequency PCB","frequency-response-pcb-material","en",{"blog":24,"breadcrumb":33},{"@context":25,"@type":26,"headline":4,"description":5,"image":8,"url":27,"datePublished":6,"dateModified":6,"timeRequired":11,"keywords":28,"articleSection":7,"author":29,"publisher":32},"https://schema.org","BlogPosting","https://hilpcb.com/cn/blog/frequency-response-pcb-material/","Frequency Response, PCB Material, Wideband Design, Dispersion, Material Characterization, High Frequency PCB",{"@type":30,"name":31},"Organization","HILPCB",{"@type":30,"name":31},{"@context":25,"@type":34,"itemListElement":35},"BreadcrumbList",[36,41,45],{"@type":37,"position":38,"name":39,"item":40},"ListItem",1,"Home","https://hilpcb.com/",{"@type":37,"position":42,"name":43,"item":44},2,"Blog","https://hilpcb.com/cn/blog/",{"@type":37,"position":46,"name":21,"item":27},3,1791623262119]