[{"data":1,"prerenderedAt":47},["ShallowReactive",2],{"blog-moisture-effect-hf-pcb-material-cn":3},{"title":4,"description":5,"date":6,"lastUpdated":6,"category":7,"image":8,"readingTime":9,"wordCount":10,"timeRequired":11,"htmlContent":12,"faq":13,"tags":14,"slug":21,"sourceLocale":22,"jsonld":23},"Moisture Effects on HF PCB Material: Humidity Impact on High Frequency Performance","Complete guide to moisture effects on high frequency PCB materials covering absorption mechanisms, Dk and Df changes, reliability impacts, and material selection for humidity-resistant designs.","2025-04-11","materials","/assets/img/blogs/2025/04/moisture-effect-hf-pcb-material.webp",7,1314,"PT7M","\u003Cp>Moisture absorption changes the electrical properties of PCB materials in ways that directly affect high frequency performance. Water has extremely high dielectric constant (Dk ~80) and significant loss—even small amounts absorbed into PCB material alter Dk, increase Df, and degrade signal integrity. Understanding moisture effects enables material selection and design choices that maintain stable performance across humidity conditions.\u003C/p>\n\u003Cp>This guide provides comprehensive knowledge of moisture effects on \u003Ca href=\"/cn/blog/high-frequency-pcb-material-performance/\">HF PCB material performance\u003C/a>, from fundamental mechanisms to practical mitigation strategies.\u003C/p>\n\u003Cp>HILPCB offers low-absorption high frequency materials including \u003Ca href=\"/cn/products/teflon-pcb/\">PTFE-based laminates\u003C/a> that maintain stable properties in humid environments.\u003C/p>\n\u003Ch2>Moisture Absorption Mechanisms\u003C/h2>\n\u003Cp>PCB materials absorb moisture through several mechanisms that depend on material composition and environmental conditions. Understanding these mechanisms guides material selection and design for moisture resistance.\u003C/p>\n\u003Cp>At HILPCB, we can recommend materials with appropriate moisture characteristics for your operating environment.\u003C/p>\n\u003Cp>\u003Cstrong>Diffusion Absorption\u003C/strong>\u003C/p>\n\u003Cp>Water molecules diffuse into the polymer matrix:\u003C/p>\n\u003Cul>\n\u003Cli>Rate depends on material composition\u003C/li>\n\u003Cli>Higher temperature accelerates diffusion\u003C/li>\n\u003Cli>Equilibrium reached over hours to days\u003C/li>\n\u003Cli>Reversible with drying (partially)\u003C/li>\n\u003C/ul>\n\u003Cp>Different polymers have different diffusion characteristics—epoxy (FR-4) absorbs more readily than fluoropolymers (PTFE).\u003C/p>\n\u003Cp>\u003Cstrong>Capillary Absorption\u003C/strong>\u003C/p>\n\u003Cp>Water wicks along interfaces and into voids:\u003C/p>\n\u003Cul>\n\u003Cli>Glass-resin interfaces in laminates\u003C/li>\n\u003Cli>Microvoids from manufacturing\u003C/li>\n\u003Cli>Delamination sites\u003C/li>\n\u003Cli>Via barrels and holes\u003C/li>\n\u003C/ul>\n\u003Cp>Capillary absorption can be faster than diffusion and harder to reverse.\u003C/p>\n\u003Cp>\u003Cstrong>Surface Adsorption\u003C/strong>\u003C/p>\n\u003Cp>Water molecules adhere to material surfaces:\u003C/p>\n\u003Cul>\n\u003Cli>Quick onset with humidity change\u003C/li>\n\u003Cli>Affects surface conductivity\u003C/li>\n\u003Cli>Can penetrate surface features\u003C/li>\n\u003Cli>Most easily reversed\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Absorption Rates by Material\u003C/strong>\u003C/p>\n\u003Ctable>\n\u003Cthead>\n\u003Ctr>\n\u003Cth>Material\u003C/th>\n\u003Cth>Absorption (% by weight)\u003C/th>\n\u003Cth>Time to Equilibrium\u003C/th>\n\u003C/tr>\n\u003C/thead>\n\u003Ctbody>\u003Ctr>\n\u003Ctd>Standard FR-4\u003C/td>\n\u003Ctd>0.10-0.15%\u003C/td>\n\u003Ctd>24-48 hours\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Low-Dk FR-4\u003C/td>\n\u003Ctd>0.08-0.12%\u003C/td>\n\u003Ctd>24-48 hours\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Rogers RO4350B\u003C/td>\n\u003Ctd>0.06%\u003C/td>\n\u003Ctd>48-72 hours\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>PTFE (RT/duroid)\u003C/td>\n\u003Ctd>0.02%\u003C/td>\n\u003Ctd>72+ hours\u003C/td>\n\u003C/tr>\n\u003C/tbody>\u003C/table>\n\u003Cp>Lower absorption materials maintain more stable properties.\u003C/p>\n\u003Ch2>Effects on Dielectric Constant\u003C/h2>\n\u003Cp>Water's extremely high Dk (approximately 80) dramatically affects composite Dk when absorbed into PCB materials.\u003C/p>\n\u003Cp>HILPCB provides \u003Ca href=\"/cn/products/high-frequency-pcb/\">precision RF board manufacturing\u003C/a> with materials selected for Dk stability in your operating environment.\u003C/p>\n\u003Cp>\u003Cstrong>Dk Increase Mechanism\u003C/strong>\u003C/p>\n\u003Cp>When water absorbs into material:\u003C/p>\n\u003Cul>\n\u003Cli>Water Dk ~80 replaces air (Dk ~1) in voids\u003C/li>\n\u003Cli>Water associates with polar groups in polymer\u003C/li>\n\u003Cli>Effective Dk of composite increases\u003C/li>\n\u003Cli>Effect proportional to water content\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Magnitude of Dk Change\u003C/strong>\u003C/p>\n\u003Cp>For typical materials at saturation:\u003C/p>\n\u003Cul>\n\u003Cli>FR-4 (0.15% absorption): Dk increase ~2-4%\u003C/li>\n\u003Cli>Low-loss laminate (0.08%): Dk increase ~1-2%\u003C/li>\n\u003Cli>PTFE (0.02%): Dk increase <0.5%\u003C/li>\n\u003C/ul>\n\u003Cdiv style=\"background: linear-gradient(135deg, #7c2d12 0%, #c2410c 100%); border-radius: 20px; padding: 32px 24px; margin: 32px 0; box-shadow: 0 12px 32px rgba(0,0,0,0.3);\">\n\u003Ch3 style=\"color: #ffedd5; font-size: 17px; font-weight: 700; margin: 0 0 24px 0; text-align: center;\">Moisture Absorption Comparison\u003C/h3>\n\u003Cdiv style=\"display: grid; grid-template-columns: repeat(2, 1fr); gap: 16px;\">\n\u003Cdiv style=\"background: rgba(255,255,255,0.1); border-radius: 10px; padding: 20px 14px; text-align: center;\">\n\u003Cdiv style=\"font-size: 22px; font-weight: 800; color: #fed7aa;\">FR-4\u003C/div>\n\u003Cdiv style=\"font-size: 12px; color: #fdba74; margin-top: 6px;\">0.10-0.15% | Dk +2-4%\u003C/div>\n\u003C/div>\n\u003Cdiv style=\"background: rgba(255,255,255,0.1); border-radius: 10px; padding: 20px 14px; text-align: center;\">\n\u003Cdiv style=\"font-size: 22px; font-weight: 800; color: #fed7aa;\">Low-Loss\u003C/div>\n\u003Cdiv style=\"font-size: 12px; color: #fdba74; margin-top: 6px;\">0.06-0.08% | Dk +1-2%\u003C/div>\n\u003C/div>\n\u003Cdiv style=\"background: rgba(255,255,255,0.1); border-radius: 10px; padding: 20px 14px; text-align: center;\">\n\u003Cdiv style=\"font-size: 22px; font-weight: 800; color: #fed7aa;\">Rogers\u003C/div>\n\u003Cdiv style=\"font-size: 12px; color: #fdba74; margin-top: 6px;\">0.04-0.06% | Dk +0.5-1%\u003C/div>\n\u003C/div>\n\u003Cdiv style=\"background: rgba(255,255,255,0.1); border-radius: 10px; padding: 20px 14px; text-align: center;\">\n\u003Cdiv style=\"font-size: 22px; font-weight: 800; color: #fed7aa;\">PTFE\u003C/div>\n\u003Cdiv style=\"font-size: 12px; color: #fdba74; margin-top: 6px;\">0.01-0.02% | Dk <0.5%\u003C/div>\n\u003C/div>\n\u003C/div>\n\u003C/div>\n\n\u003Cp>\u003Cstrong>Impedance Impact\u003C/strong>\u003C/p>\n\u003Cp>Dk increase lowers impedance:\u003C/p>\n\u003Cp>ΔZ/Z ≈ -0.5 × ΔDk/Dk\u003C/p>\n\u003Cp>For FR-4 with 3% Dk increase: ~1.5% impedance decrease\u003C/p>\n\u003Cp>This may exceed tolerance for precision impedance applications.\u003C/p>\n\u003Cp>\u003Cstrong>Frequency Selectivity\u003C/strong>\u003C/p>\n\u003Cp>Moisture absorption affects different frequencies differently:\u003C/p>\n\u003Cul>\n\u003Cli>Water relaxation peak around 20 GHz\u003C/li>\n\u003Cli>Effects more pronounced at microwave frequencies\u003C/li>\n\u003Cli>Complex frequency-dependent behavior\u003C/li>\n\u003C/ul>\n\u003Ch2>Effects on Dissipation Factor\u003C/h2>\n\u003Cp>Moisture dramatically increases Df because water is a lossy dielectric (Df ~0.15 at microwave frequencies).\u003C/p>\n\u003Cp>For loss-sensitive applications, HILPCB recommends low-absorption materials from our \u003Ca href=\"/cn/pcb-manufacturing/\">high frequency laminate inventory\u003C/a>.\u003C/p>\n\u003Cp>\u003Cstrong>Df Increase Mechanism\u003C/strong>\u003C/p>\n\u003Cp>Water molecules introduce loss through:\u003C/p>\n\u003Cul>\n\u003Cli>Dipole relaxation losses\u003C/li>\n\u003Cli>Ionic conduction (if dissolved salts present)\u003C/li>\n\u003Cli>Enhanced interfacial polarization\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Magnitude of Df Change\u003C/strong>\u003C/p>\n\u003Cp>Moisture absorption can significantly increase Df:\u003C/p>\n\u003Cul>\n\u003Cli>FR-4: Df may double or triple at saturation\u003C/li>\n\u003Cli>Low-loss materials: 50-100% increase possible\u003C/li>\n\u003Cli>PTFE: Minimal change (<20%)\u003C/li>\n\u003C/ul>\n\u003Cp>For low-loss applications, even small Df increases matter significantly.\u003C/p>\n\u003Cp>\u003Cstrong>Loss Impact Example\u003C/strong>\u003C/p>\n\u003Cp>6-inch 50Ω microstrip at 10 GHz:\u003C/p>\n\u003Cul>\n\u003Cli>Dry low-loss material (Df 0.004): ~1.2 dB loss\u003C/li>\n\u003Cli>Same material moisture saturated (Df 0.008): ~2.4 dB loss\u003C/li>\n\u003C/ul>\n\u003Cp>Moisture doubled the loss—potentially causing link failure.\u003C/p>\n\u003Ch2>Reliability and Mechanical Effects\u003C/h2>\n\u003Cp>Beyond electrical effects, moisture absorption affects mechanical properties and long-term reliability.\u003C/p>\n\u003Cp>\u003Cstrong>Mechanical Property Changes\u003C/strong>\u003C/p>\n\u003Cp>Moisture absorption causes:\u003C/p>\n\u003Cul>\n\u003Cli>Dimensional swelling (especially Z-axis)\u003C/li>\n\u003Cli>Reduced glass transition temperature\u003C/li>\n\u003Cli>Lower mechanical strength\u003C/li>\n\u003Cli>Increased creep rate\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Delamination Risk\u003C/strong>\u003C/p>\n\u003Cp>Absorbed moisture can cause delamination:\u003C/p>\n\u003Cul>\n\u003Cli>Moisture vaporizes during thermal excursion\u003C/li>\n\u003Cli>Vapor pressure creates internal stress\u003C/li>\n\u003Cli>"Popcorning" during reflow\u003C/li>\n\u003Cli>Interface separation\u003C/li>\n\u003C/ul>\n\u003Cp>Pre-bake boards before assembly to drive out moisture.\u003C/p>\n\u003Cp>\u003Cstrong>Electrochemical Effects\u003C/strong>\u003C/p>\n\u003Cp>Moisture enables electrochemical degradation:\u003C/p>\n\u003Cul>\n\u003Cli>Conductive anodic filament (CAF) growth\u003C/li>\n\u003Cli>Dendritic growth between conductors\u003C/li>\n\u003Cli>Corrosion of copper features\u003C/li>\n\u003Cli>Reduced insulation resistance\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Long-Term Reliability\u003C/strong>\u003C/p>\n\u003Cp>Extended humidity exposure accelerates:\u003C/p>\n\u003Cul>\n\u003Cli>Metal migration\u003C/li>\n\u003Cli>Surface contamination effects\u003C/li>\n\u003Cli>Interfacial degradation\u003C/li>\n\u003Cli>Electrical leakage\u003C/li>\n\u003C/ul>\n\u003Ch2>Material Selection for Humid Environments\u003C/h2>\n\u003Cp>Systematic approach to selecting materials for moisture resistance.\u003C/p>\n\u003Cp>HILPCB provides material consultation for applications requiring humidity resistance, including \u003Ca href=\"/cn/products/rogers-pcb/\">Rogers laminate options\u003C/a> with excellent moisture performance.\u003C/p>\n\u003Cp>\u003Cstrong>Low-Absorption Material Options\u003C/strong>\u003C/p>\n\u003Cp>For best moisture resistance:\u003C/p>\n\u003Cul>\n\u003Cli>\u003Cstrong>PTFE-based:\u003C/strong> Lowest absorption (<0.03%), best stability\u003C/li>\n\u003Cli>\u003Cstrong>Rogers RO4000 series:\u003C/strong> Low absorption (0.04-0.06%), FR-4 processable\u003C/li>\n\u003Cli>\u003Cstrong>Polyimide:\u003C/strong> Moderate absorption but stable properties\u003C/li>\n\u003Cli>\u003Cstrong>Ceramic-filled:\u003C/strong> Low absorption, good stability\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Application-Based Selection\u003C/strong>\u003C/p>\n\u003Ctable>\n\u003Cthead>\n\u003Ctr>\n\u003Cth>Environment\u003C/th>\n\u003Cth>Recommended Material Class\u003C/th>\n\u003C/tr>\n\u003C/thead>\n\u003Ctbody>\u003Ctr>\n\u003Ctd>Controlled indoor\u003C/td>\n\u003Ctd>Standard materials adequate\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Variable indoor\u003C/td>\n\u003Ctd>Mid-range absorption materials\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Outdoor sheltered\u003C/td>\n\u003Ctd>Low-absorption recommended\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Outdoor exposed\u003C/td>\n\u003Ctd>PTFE or ceramic, conformal coat\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Marine/tropical\u003C/td>\n\u003Ctd>Lowest absorption, sealed enclosure\u003C/td>\n\u003C/tr>\n\u003C/tbody>\u003C/table>\n\u003Cp>\u003Cstrong>Design Considerations\u003C/strong>\u003C/p>\n\u003Cp>Beyond material selection:\u003C/p>\n\u003Cul>\n\u003Cli>Conformal coating reduces moisture ingress\u003C/li>\n\u003Cli>Sealed enclosures protect from humidity\u003C/li>\n\u003Cli>Edge plating prevents edge absorption\u003C/li>\n\u003Cli>Proper storage prevents pre-assembly absorption\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Pre-Assembly Baking\u003C/strong>\u003C/p>\n\u003Cp>Remove absorbed moisture before assembly:\u003C/p>\n\u003Cul>\n\u003Cli>Bake temperature: 105-125°C typical\u003C/li>\n\u003Cli>Duration: 2-8 hours depending on thickness\u003C/li>\n\u003Cli>Prevents popcorning during reflow\u003C/li>\n\u003Cli>Especially important for humidity-exposed boards\u003C/li>\n\u003C/ul>\n\u003Ch2>Testing and Qualification\u003C/h2>\n\u003Cp>Verify moisture performance for critical applications.\u003C/p>\n\u003Cp>HILPCB supports moisture qualification testing and can recommend appropriate test protocols.\u003C/p>\n\u003Cp>\u003Cstrong>Standard Test Methods\u003C/strong>\u003C/p>\n\u003Cp>IPC-TM-650 methods for moisture characterization:\u003C/p>\n\u003Cul>\n\u003Cli>2.6.2.1: Moisture absorption\u003C/li>\n\u003Cli>2.5.5.9: Permittivity and loss tangent\u003C/li>\n\u003Cli>2.6.3: Thermal stress (includes moisture effects)\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Accelerated Testing\u003C/strong>\u003C/p>\n\u003Cp>HAST (Highly Accelerated Stress Test):\u003C/p>\n\u003Cul>\n\u003Cli>130°C, 85% RH, biased\u003C/li>\n\u003Cli>Accelerates moisture-related failures\u003C/li>\n\u003Cli>Standard for reliability qualification\u003C/li>\n\u003C/ul>\n\u003Cp>85/85 Testing:\u003C/p>\n\u003Cul>\n\u003Cli>85°C, 85% RH, extended duration\u003C/li>\n\u003Cli>Less acceleration, more representative\u003C/li>\n\u003Cli>1000 hours typical\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Electrical Monitoring\u003C/strong>\u003C/p>\n\u003Cp>Track electrical parameters during humidity exposure:\u003C/p>\n\u003Cul>\n\u003Cli>Insulation resistance\u003C/li>\n\u003Cli>Dk/Df changes\u003C/li>\n\u003Cli>Impedance drift\u003C/li>\n\u003Cli>Leakage current\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Acceptance Criteria\u003C/strong>\u003C/p>\n\u003Cp>Define acceptable changes:\u003C/p>\n\u003Cul>\n\u003Cli>Dk change: Typically <3-5%\u003C/li>\n\u003Cli>Df change: Typically <50%\u003C/li>\n\u003Cli>Insulation resistance: Maintain minimum value\u003C/li>\n\u003Cli>No visible degradation\u003C/li>\n\u003C/ul>\n\u003Chr>\n\u003Ch2>Related Material Performance Topics\u003C/h2>\n\u003Cul>\n\u003Cli>\u003Cstrong>\u003Ca href=\"/cn/blog/high-frequency-pcb-material-performance/\">High Frequency PCB Material Performance\u003C/a>:\u003C/strong> Complete material selection guide\u003C/li>\n\u003Cli>\u003Cstrong>\u003Ca href=\"/cn/blog/dielectric-properties-hf-pcb/\">Dielectric Properties of HF PCB\u003C/a>:\u003C/strong> Dk and Df fundamentals\u003C/li>\n\u003Cli>\u003Cstrong>\u003Ca href=\"/cn/blog/material-loss-factor-hf-pcb/\">Material Loss Factor in HF PCB\u003C/a>:\u003C/strong> Loss mechanisms and minimization\u003C/li>\n\u003Cli>\u003Cstrong>\u003Ca href=\"/cn/blog/thermal-stability-high-frequency-pcb/\">Thermal Stability in High Frequency PCB\u003C/a>:\u003C/strong> Temperature effects\u003C/li>\n\u003Cli>\u003Cstrong>\u003Ca href=\"/cn/blog/frequency-response-pcb-material/\">Frequency Response of PCB Material\u003C/a>:\u003C/strong> Wideband characterization\u003C/li>\n\u003C/ul>\n\u003Cdiv data-component=\"BlogQuickQuoteInline\">\u003C/div>\n\n\u003Chr>\n\u003Ch2>HILPCB Moisture-Resistant PCB Services\u003C/h2>\n\u003Cp>HILPCB delivers moisture-stable high frequency PCBs:\u003C/p>\n\u003Cp>\u003Cstrong>Material Selection:\u003C/strong> Low-absorption materials including PTFE, ceramic-filled, and specialty laminates for humid environments.\u003C/p>\n\u003Cp>\u003Cstrong>Process Control:\u003C/strong> Proper material storage and handling to prevent pre-assembly moisture issues.\u003C/p>\n\u003Cp>\u003Cstrong>Baking Services:\u003C/strong> Pre-assembly baking available for moisture-sensitive materials and assemblies.\u003C/p>\n\u003Cp>\u003Cstrong>Reliability Support:\u003C/strong> Qualification testing support for humidity-critical applications.\u003C/p>\n\u003Cp>From \u003Ca href=\"/cn/products/small-batch-assembly/\">prototype development\u003C/a> through \u003Ca href=\"/cn/products/large-volume-assembly/\">volume production\u003C/a>, HILPCB provides moisture-resistant high frequency PCBs for demanding environments.\u003C/p>\n\u003Cp>Contact HILPCB for moisture resistance consultation and manufacturing quotation.\u003C/p>\n\n\u003Csection class=\"related-links\" aria-label=\"Related\">\u003Ch3>Related links\u003C/h3>\u003Cul>\u003Cli>\u003Ca href=\"/cn/blog/high-frequency-pcb-material-performance/\">High Frequency PCB Material Performance: Complete Selection and Analysis Guide\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/cn/products/teflon-pcb/\">PTFE-based laminates\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/cn/products/high-frequency-pcb/\">precision RF board manufacturing\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/cn/pcb-manufacturing/\">high frequency laminate inventory\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/cn/products/rogers-pcb/\">Rogers laminate options\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/cn/blog/dielectric-properties-hf-pcb/\">PCB材料介电常数 (Dk)：定义、单位、计算公式与损耗角正切 (Df)\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/cn/blog/material-loss-factor-hf-pcb/\">Material Loss Factor in HF PCB: Understanding and Minimizing Signal Attenuation\u003C/a>\u003C/li>\u003C/ul>\u003C/section>",[],[15,16,17,18,19,20],"Moisture Effects","High Frequency PCB","Humidity","PCB Reliability","Material Absorption","Environmental Stability","moisture-effect-hf-pcb-material","en",{"blog":24,"breadcrumb":33},{"@context":25,"@type":26,"headline":4,"description":5,"image":8,"url":27,"datePublished":6,"dateModified":6,"timeRequired":11,"keywords":28,"articleSection":7,"author":29,"publisher":32},"https://schema.org","BlogPosting","https://hilpcb.com/cn/blog/moisture-effect-hf-pcb-material/","Moisture Effects, High Frequency PCB, Humidity, PCB Reliability, Material Absorption, Environmental Stability",{"@type":30,"name":31},"Organization","HILPCB",{"@type":30,"name":31},{"@context":25,"@type":34,"itemListElement":35},"BreadcrumbList",[36,41,45],{"@type":37,"position":38,"name":39,"item":40},"ListItem",1,"Home","https://hilpcb.com/",{"@type":37,"position":42,"name":43,"item":44},2,"Blog","https://hilpcb.com/cn/blog/",{"@type":37,"position":46,"name":21,"item":27},3,1791623262210]