[{"data":1,"prerenderedAt":196},["ShallowReactive",2],{"blog-initial-cn-12":3},{"posts":4,"totalPosts":185,"totalPages":186,"currentPage":187,"categories":188,"availableYears":194,"hasMore":12},[5,22,35,47,59,85,98,111,123,135,149,172],{"id":6,"slug":6,"title":7,"description":8,"date":9,"category":10,"image":11,"featured":12,"tags":13,"readingTime":19,"year":20,"month":21},"cti-pcb-material-selection","PCB材料CTI等级选择指南：爬电距离、叠层绝缘与DFM验证","系统解析PCB材料CTI等级怎么选，涵盖爬电距离、板材分类、叠层绝缘风险、制造DFM与验证流程，适用于高压、高可靠性和车规项目。","2026-03-19","technology","/assets/img/blogs/2026/03/cti-pcb-material-selection.webp",true,[14,15,16,17,18],"PCB材料CTI","CTI等级选择","爬电距离设计","绝缘可靠性","材料DFM评审",9,2026,3,{"id":23,"slug":23,"title":24,"description":25,"date":26,"category":10,"image":27,"featured":12,"tags":28,"readingTime":34,"year":20,"month":21},"cpo-baseboard-design","CPO基板设计指南：叠层、热设计、高速布线与DFM验证","系统解析CPO基板设计要点，涵盖共封装光学基板叠层与材料、高速通道布局、热管理、组装DFM、样机验证及量产导入风险。","2026-03-18","/assets/img/blogs/2026/03/cpo-baseboard-design.webp",[29,30,31,32,33],"CPO基板设计","共封装光学基板","高速PCB设计","CPO热管理","CPO DFM验证",8,{"id":36,"slug":36,"title":37,"description":38,"date":39,"category":10,"image":40,"featured":12,"tags":41,"readingTime":34,"year":20,"month":21},"ai-server-backplane-pcb","AI服务器背板PCB设计指南：叠层、信号完整性、散热与DFM","系统解析AI服务器背板PCB设计要点，涵盖高速叠层选型、信号完整性、PDN设计、散热方案及DFM可制造性评审，助力量产一致性。","2026-03-16","/assets/img/blogs/2026/03/ai-server-backplane-pcb.webp",[42,43,44,45,46],"AI服务器背板PCB","高速背板设计","背板PCB叠层","AI服务器PCB散热","背板DFM评审",{"id":48,"slug":48,"title":49,"description":50,"date":51,"category":10,"image":52,"featured":12,"tags":53,"readingTime":34,"year":20,"month":21},"48v-12v-power-board","48V转12V电源板设计指南：大电流路径、EMI控制、热设计与量产验证","系统解析 48V 转 12V 电源板设计要点，涵盖拓扑评估、大电流路径、开关回路、EMI、热设计、连接器可靠性与量产 DFM 验证，适用于数据中心、工业控制与车载子系统项目。","2026-03-15","/assets/img/blogs/2026/03/48v-12v-power-board.webp",[54,55,56,57,58],"48V转12V电源板","大电流电源PCB","EMI与热设计","厚铜电源板","量产DFM验证",{"id":60,"slug":60,"title":61,"description":62,"date":63,"category":64,"image":65,"featured":66,"tags":67,"readingTime":19,"year":20,"month":21},"fpga-pcb","针对 BGA 扇出、电源完整性和多千兆位通道的 FPGA PCB 布局","FPGA PCB 设计，涵盖 BGA 扇出布线、多轨 PDN 构建、SERDES 通道损耗预算、DDR 内存布局和热过孔策略。","2026-03-12","manufacturing","/assets/img/blogs/2026/03/fpga-pcb.webp",false,[68,69,70,71,72,73,74,75,76,77,78,79,80,81,82,83,84],"FPGA PCB","FPGA电路板布局","BGA扇出布线","FPGA电源完整性","SERDES通道PCB","DDR4 FPGA布局","Xilinx Versal开发板","Intel Agilex PCB","盘中孔FPGA","FPGA去耦策略","多千兆收发器板","背钻FPGA过孔","LVDS差分走线","Kintex UltraScale板","FPGA热过孔阵列","HDI BGA逃逸布线","FPGA开发板PCB",{"id":86,"slug":86,"title":87,"description":88,"date":89,"category":10,"image":90,"featured":12,"tags":91,"readingTime":34,"year":20,"month":21},"hbm3-interposer-quality","HBM3 interposer PCB quality：驾驭AI芯片互连与载板PCB的封装与高速互连挑战","深度解析HBM3 interposer PCB quality的核心技术，涵盖高速信号完整性、热管理与电源/互连设计，助力您打造高性能AI芯片互连与载板PCB。","2026-03-07","/assets/img/blogs/2025/11/microvias-pcb.webp",[92,93,94,95,96,97],"HBM3 interposer PCB quality","HBM3 interposer PCB","HBM3 interposer PCB checklist","HBM3 interposer PCB quick turn","HBM3 interposer PCB reliability","low-loss HBM3 interposer PCB",{"id":99,"slug":99,"title":100,"description":101,"date":89,"category":10,"image":102,"featured":12,"tags":103,"readingTime":110,"year":20,"month":21},"lidar-interface-board-assembly","LiDAR interface board assembly：驾驭汽车ADAS与EV电源PCB的车规可靠性与高压安全挑战","深度解析LiDAR interface board assembly的核心技术，涵盖高速信号完整性、热管理与电源/互连设计，助力您打造高性能汽车ADAS与EV电源PCB。","/assets/img/blogs/2025/11/adas-pcb.webp",[104,105,106,107,108,109],"LiDAR interface board assembly","low-loss LiDAR interface board","LiDAR interface board stackup","LiDAR interface board cost optimization","LiDAR interface board quick turn","LiDAR interface board reliability",14,{"id":112,"slug":112,"title":113,"description":114,"date":89,"category":10,"image":115,"featured":12,"tags":116,"readingTime":34,"year":20,"month":21},"split-plane-design-guide","split plane design guide：从概念到版图的PCB设计入门实战","围绕split plane design guide系统讲解 PCB 设计思维、叠层规划、布线与 DRC 检查要点，配套可打印清单与案例，帮助新人快速上手。","/assets/img/blogs/2025/09/pcb-design.webp",[117,118,119,120,121,122],"split plane design guide","differential pair basics","drc rule template pcb","guard trace design","mixed signal pcb layout","pcb documentation tutorial",{"id":124,"slug":124,"title":125,"description":126,"date":89,"category":10,"image":127,"featured":12,"tags":128,"readingTime":34,"year":20,"month":21},"three-phase-inverter-control","Three-phase inverter control PCB manufacturing：驾驭可再生能源逆变器PCB的高压大电流与效率挑战","深度解析Three-phase inverter control PCB manufacturing的核心技术，涵盖高速信号完整性、热管理与电源/互连设计，助力您打造高性能可再生能源逆变器PCB。","/assets/img/blogs/2025/11/solar-inverter-pcb-manufacturing.webp",[129,130,131,132,133,134],"Three-phase inverter control PCB manufacturing","Three-phase inverter control PCB routing","Three-phase inverter control PCB low volume","Three-phase inverter control PCB validation","Three-phase inverter control PCB testing","Three-phase inverter control PCB quick turn",{"id":136,"slug":136,"title":137,"description":138,"date":139,"category":10,"image":140,"featured":12,"tags":141,"readingTime":148,"year":20,"month":21},"phase-consistency-routing","Phase consistency routing quick turn：驾驭5G/6G通信PCB的毫米波与低损耗互连挑战","深度解析Phase consistency routing quick turn的核心技术，涵盖高速信号完整性、热管理与电源/互连设计，助力您打造高性能5G/6G通信PCB。","2026-03-05","/assets/img/blogs/2025/11/mmwave-pcb-manufacturing.webp",[142,143,144,145,146,147],"Phase consistency routing quick turn","automotive-grade Phase consistency routing","Phase consistency routing compliance","Phase consistency routing materials","Phase consistency routing","Phase consistency routing cost optimization",21,{"id":150,"slug":150,"title":151,"description":152,"date":139,"category":64,"image":153,"featured":66,"tags":154,"readingTime":34,"year":20,"month":21},"smart-meter-pcb","面向AMI网络、防窃电及20年使用寿命的智能电表PCB","智能电表PCB，涵盖计量级模拟前端、PLC和NB-IoT通信、防窃电硬件、高压隔离以及20年的可靠性。","/assets/img/blogs/2026/03/smart-meter-pcb.webp",[155,156,157,158,159,160,161,162,163,164,165,166,167,168,169,170,171],"智能电表PCB","电能表电路板","AMI电表PCB设计","电能表板布局","电力线载波通信PCB","NB-IoT智能电表板","计量PCB前端","防窃电电表板","三相电表PCB","预付费电表电路板","水表电子PCB","气表PCB设计","计费电能表板","电流互感器电表PCB","智能电网电路板","DLMS协议电表板","公用事业电表PCB制造",{"id":173,"slug":173,"title":174,"description":175,"date":176,"category":10,"image":177,"featured":12,"tags":178,"readingTime":34,"year":20,"month":21},"48v-12v-conversion-quality","48V to 12V conversion board quality：驾驭供电与冷却系统PCB的高功率密度与热管理挑战","深度解析48V to 12V conversion board quality的核心技术，涵盖高速信号完整性、热管理与电源/互连设计，助力您打造高性能供电与冷却系统PCB。","2026-03-03","/assets/img/blogs/2025/10/power-pcb.webp",[179,180,181,182,183,184],"48V to 12V conversion board quality","48V to 12V conversion board low volume","48V to 12V conversion board materials","data-center 48V to 12V conversion board","48V to 12V conversion board guide","48V to 12V conversion board design",1561,131,12,[10,64,189,190,191,192,193],"assembly","design","standards","materials","testing",[20,195],2025,1791854257946]