[{"data":1,"prerenderedAt":178},["ShallowReactive",2],{"blog-initial-de-25":3},{"posts":4,"totalPosts":169,"totalPages":170,"currentPage":171,"categories":172,"availableYears":176,"hasMore":48},[5,24,42,59,71,84,101,114,126,138,149,156],{"id":6,"slug":6,"title":7,"description":8,"date":9,"category":10,"image":11,"featured":12,"tags":13,"readingTime":21,"year":22,"month":23},"stack-balance-hf-pcb","HF-PCB-Stack-up: Symmetrie, Kupferbalance und Verzug","HF-PCB-Stack-up gegen Verwölbung und Verwindung auslegen: Lagensymmetrie, Kupferbalance, Hybridmaterial, Prepreg, Panel, Reflow-Messung sowie RFQ und DFM.","2025-12-20","design","/assets/img/blogs/2025/12/stack-balance-hf-pcb.webp",false,[14,15,16,17,18,19,20],"HF PCB Stackup","symmetrischer Lagenaufbau","Kupferbalance","Leiterplattenverzug","Hybrid Stackup","PCB Verwölbung","PCB Verwindung",5,2025,12,{"id":25,"slug":25,"title":26,"description":27,"date":9,"category":28,"image":29,"featured":12,"tags":30,"readingTime":41,"year":22,"month":23},"transparent-pcb-manufacturing","Leitfaden zur Herstellung transparenter PCBs: Materialien & Prozesse","Leitfaden zur Herstellung transparenter PCBs: Glas-/CPI-Substrate, Metallisierung, TGV, Bestückung, optische Qualitätskontrolle und Lieferanten-Checkliste.","manufacturing","/assets/img/blogs/2025/12/transparent-pcb-manufacturing.webp",[31,32,33,34,35,36,37,38,39,40],"Herstellung transparenter PCBs","Transparente PCB","Klare Leiterplatte","Durchsichtige Leiterplatte","Glas-PCB","Transparente Elektronik","Durchkontaktierung durch Glas","Optische PCB","Transparente CPI-Folie","Optische Qualitätskontrolle",8,{"id":43,"slug":43,"title":44,"description":45,"date":46,"category":28,"image":47,"featured":48,"tags":49,"readingTime":58,"year":22,"month":23},"camera-pcb","Kamera-PCB-Design und Fertigungsservice","Hochpräzise Kamera-PCB-Fertigung für CMOS-Sensoren, Sicherheitskameras und industrielle Vision-Systeme. Schnelle Bearbeitung und weltweiter Versand.","2025-12-19","/assets/img/blogs/2025/12/camera-pcb.webp",true,[50,51,52,53,54,55,56,57],"Kamera-PCB","CMOS-Sensor-PCB","Sicherheitskamera-Platine","Industrielles Kameramodul","PCB-Montage","Kameraelektronik","Bildgebungssysteme","Unterhaltungselektronik",4,{"id":60,"slug":60,"title":61,"description":62,"date":46,"category":28,"image":63,"featured":12,"tags":64,"readingTime":23,"year":22,"month":23},"edge-plated-pcb","Edge-Plated-PCB-Design für Hochgeschwindigkeitsverbindungen","HilPCB PCB Factory liefert leistungsstarke Edge-Plated-PCBs für zuverlässige, schnelle Verbindungen in verschiedensten Branchen.","/assets/img/blogs/2025/12/edge-plated-pcb.webp",[65,66,67,68,69,70],"Edge Plated PCB","PCB Randbeschichtung","Hochleistungs-PCB","flexible PCB","High-Speed-Verbindungen","kundenspezifische PCB-Lösungen",{"id":72,"slug":72,"title":73,"description":74,"date":46,"category":75,"image":76,"featured":48,"tags":77,"readingTime":41,"year":22,"month":23},"fixture-design-ict-fct-medical-imaging-wearable","Fixture design (ICT/FCT): IEC 60601 Safety und ISO 10993 Biocompatibility für Medical Imaging und Wearable PCB erfüllen","Deep Dive zu Fixture design (ICT/FCT) für Medical Imaging und Wearables—wie Teststrategien IEC 60601 Electrical Safety und ISO 10993 Biocompatibility absichern und Reliability/Compliance über den gesamten Produktlebenszyklus ermöglichen.","technology","/assets/img/blogs/ict-testing.webp",[78,79,80,81,82,83],"Fixture design (ICT/FCT)","SMT assembly","Flying probe test","NPI EVT/DVT/PVT","DFM/DFT/DFA review","Selective wave soldering",{"id":85,"slug":85,"title":86,"description":87,"date":46,"category":75,"image":88,"featured":48,"tags":89,"readingTime":100,"year":22,"month":23},"metal-core-basics-pcb-stackup-materials","Leitfaden zur Materialauswahl und zum Stackup-Design für MCPCB (Metallsubstrat): Vergleich von Aluminiumbasis/Kupferbasis/IMS und Vorlagen","Für das Design von Metal Core PCB (MCPCB): Bietet Entscheidungsbäume für Materialien auf Aluminium-/Kupferbasis/IMS, Stackup-Vorlagen, Methoden zur Impedanz-, thermischen und mechanischen Modellierung sowie Verifizierungsprozesse, und enthält DFM/DFR-Checklisten zur Verbesserung der Wärmeableitung und Zuverlässigkeit.","/assets/img/blogs/2025/12/metal-core-pcb.webp",[90,91,92,93,94,95,96,97,98,99],"metal core pcb basics","mcpcb","ims pcb","aluminum core pcb","copper core pcb","flex rigid material stackup","high tg fr4 guide","halogen free pcb materials","low loss laminate tutorial","rf pcb material comparison",9,{"id":102,"slug":102,"title":103,"description":104,"date":46,"category":10,"image":105,"featured":12,"tags":106,"readingTime":113,"year":22,"month":23},"routing-clearance-hf-pcb","Routing‑Clearance in HF‑PCBs: Abstandsregeln für Übersprechen und Isolation","Umfassender Leitfaden zu Routing‑Clearance in Hochfrequenz‑PCBs: Abstandsberechnungen, Übersprechen‑Budgetierung, Isolationsanforderungen und praktische Designregeln für HF‑Signalintegrität.","/assets/img/blogs/2025/12/routing-clearance-hf-pcb.webp",[107,108,109,110,111,112],"Clearance","HF-PCB","Übersprechen","Isolation","Spacing","EMI",11,{"id":115,"slug":115,"title":116,"description":117,"date":46,"category":75,"image":118,"featured":48,"tags":119,"readingTime":41,"year":22,"month":23},"thread-light-led-lighting","Thread Light PCB: Der Kern beim Aufbau von Smart-Home-Beleuchtungsnetzwerken der nächsten Generation","Eine eingehende Untersuchung der Designprinzipien, technischen Herausforderungen und Anwendungsvorteile von Thread Light PCB. Von drahtlosen Protokollen bis zum Wärmemanagement wird umfassend analysiert, wie stabile und effiziente intelligente Beleuchtungssysteme erstellt werden können.",null,[120,121,122,123,124,125],"Thread Light PCB","Drahtlose Steuerplatine","Bewegungssensorlicht","Intelligente Beleuchtungsplatine","Vernetzte Beleuchtungsplatine","Mobile App-Steuerung",{"id":127,"slug":127,"title":128,"description":129,"date":130,"category":75,"image":118,"featured":48,"tags":131,"readingTime":41,"year":22,"month":23},"data-center-storage-datacenter-server","Datacenter-Speicher-Leiterplatte: Bewältigung der Herausforderungen hoher Geschwindigkeit und hoher Dichte bei Datacenter-Server-Leiterplatten","Eine eingehende Analyse der Kerntechnologien hinter Datacenter-Speicher-Leiterplatten, die Hochgeschwindigkeits-Signalintegrität, Wärmemanagement und Stromversorgungs-Integrität abdeckt, um Ihnen beim Bau leistungsstarker Datacenter-Hardware zu helfen.","2025-12-18",[132,133,134,135,136,137],"Datacenter-Speicher-Leiterplatte","Colocation-Datacenter-Leiterplatte","Cloud-Datacenter-Leiterplatte","Modulare-Datacenter-Leiterplatte","Datacenter-Kühlung-Leiterplatte","Edge-Datacenter-Leiterplatte",{"id":139,"slug":139,"title":140,"description":141,"date":130,"category":75,"image":118,"featured":48,"tags":142,"readingTime":41,"year":22,"month":23},"embedded-controller-consumer-electronics","Embedded Controller PCB: Bewältigung der Herausforderungen hoher Geschwindigkeit und hoher Dichte bei Rechenzentrumsserver-PCBs","Eine eingehende Analyse der Kerntechnologien hinter Embedded Controller PCBs, die Hochgeschwindigkeits-Signalintegrität, Wärmemanagement und Stromversorgungs-Integrität abdeckt, um Ihnen beim Bau leistungsstarker Rechenzentrums-Hardware zu helfen.",[143,144,145,146,147,148],"Embedded Controller PCB","CPU-Sockel-PCB","Workstation-Motherboard","Gaming-Laptop-PCB","All-in-One-PC-PCB","Desktop-Motherboard",{"id":150,"slug":150,"title":151,"description":152,"date":130,"category":75,"image":76,"featured":48,"tags":153,"readingTime":41,"year":22,"month":23},"fixture-design-ict-fct-automotive-adas-ev-power","Fixture design (ICT/FCT): Automotive ADAS- und EV-Power-PCB – Reliability und High-Voltage Safety beherrschen","Deep Dive zu Fixture design (ICT/FCT) in Automotive Electronics—integriert mit DFM/DFT/DFA review, SMT assembly und Traceability/MES—zur Validierung von High-Voltage-, High-Frequency- und High-Thermal-PCBA.",[78,154,82,83,79,155],"Traceability/MES","Potting/encapsulation",{"id":157,"slug":157,"title":158,"description":159,"date":130,"category":160,"image":161,"featured":12,"tags":162,"readingTime":168,"year":22,"month":23},"thermal-stability-high-frequency-pcb","Thermische Stabilität in Hochfrequenz‑PCBs: Temperatureinflüsse auf Materialperformance","Vollständiger Leitfaden zur thermischen Stabilität in Hochfrequenz‑PCBs: Temperatureffekte auf Dk/Df, Glasübergang (Tg), CTE‑Aspekte und Materialauswahl für thermische Zuverlässigkeit.","materials","/assets/img/blogs/2025/12/thermal-stability-high-frequency-pcb.webp",[163,108,164,165,166,167],"Thermik","Temperatur","Tg","CTE","Zuverlässigkeit",13,1561,131,25,[75,28,173,10,174,160,175],"assembly","standards","testing",[177,22],2026,1791854264133]