[{"data":1,"prerenderedAt":203},["ShallowReactive",2],{"blog-initial-en-12":3},{"posts":4,"totalPosts":192,"totalPages":193,"currentPage":194,"categories":195,"availableYears":201,"hasMore":12},[5,22,35,47,64,90,103,117,129,141,156,179],{"id":6,"slug":6,"title":7,"description":8,"date":9,"category":10,"image":11,"featured":12,"tags":13,"readingTime":19,"year":20,"month":21},"cti-pcb-material-selection","PCB Material CTI Selection Guide: Creepage Distance, Stack-Up Insulation, and DFM Validation","A practical guide to selecting PCB material CTI ratings, covering creepage distance, material classes, stack-up insulation risk, manufacturing DFM, and validation flow for high-voltage, high-reliability, and automotive projects.","2026-03-19","technology","/assets/img/blogs/2026/03/cti-pcb-material-selection.webp",true,[14,15,16,17,18],"PCB material CTI","CTI rating selection","creepage distance design","insulation reliability","material DFM review",9,2026,3,{"id":23,"slug":23,"title":24,"description":25,"date":26,"category":10,"image":27,"featured":12,"tags":28,"readingTime":34,"year":20,"month":21},"cpo-baseboard-design","CPO Baseboard Design Guide: Stack-Up, Thermal Design, High-Speed Routing, and DFM Validation","A practical guide to CPO baseboard design covering co-packaged optics stack-up and materials, high-speed channel layout, thermal management, assembly DFM, prototype validation, and production ramp risks.","2026-03-18","/assets/img/blogs/2026/03/cpo-baseboard-design.webp",[29,30,31,32,33],"CPO baseboard design","co-packaged optics baseboard","high-speed PCB design","CPO thermal management","CPO DFM validation",8,{"id":36,"slug":36,"title":37,"description":38,"date":39,"category":10,"image":40,"featured":12,"tags":41,"readingTime":34,"year":20,"month":21},"ai-server-backplane-pcb","AI Server Backplane PCB Design Guide: Stack-Up, Signal Integrity, Thermal Design, and DFM","A practical guide to AI server backplane PCB design covering high-speed stack-up selection, signal integrity, PDN design, thermal strategy, and DFM review to improve manufacturing consistency at scale.","2026-03-16","/assets/img/blogs/2026/03/ai-server-backplane-pcb.webp",[42,43,44,45,46],"AI server backplane PCB","high-speed backplane design","backplane PCB stack-up","AI server PCB thermal design","backplane DFM review",{"id":48,"slug":48,"title":49,"description":50,"date":51,"category":10,"image":52,"featured":12,"tags":53,"readingTime":34,"year":20,"month":21},"48v-12v-power-board","48V-to-12V Power Board Design Essentials: PCB Layout, Thermal Design, EMI, and Production Validation","This 48V-to-12V power board design guide covers topology selection, high-current paths, PCB thermal design, EMI layout, connector reliability, and production validation to help teams reduce pre-compliance failures and rework risk in volume manufacturing.","2026-03-15","/assets/img/blogs/2026/03/48v-12v-power-board.webp",[54,55,56,57,58,59,60,61,62,63],"48V-to-12V","power PCB design","DC-DC converter PCB","thermal design","power integrity","heavy copper PCB","PCB assembly","EMI layout","high-current PCB","DFM",{"id":65,"slug":65,"title":66,"description":67,"date":68,"category":69,"image":70,"featured":71,"tags":72,"readingTime":19,"year":20,"month":21},"fpga-pcb","FPGA PCB Layout for BGA Escape, Power Integrity, and Multi-Gigabit Channels","FPGA PCB design covering BGA breakout routing, multi-rail PDN construction, SERDES channel loss budgets, DDR memory layout, and thermal via strategies.","2026-03-12","manufacturing","/assets/img/blogs/2026/03/fpga-pcb.webp",false,[73,74,75,76,77,78,79,80,81,82,83,84,85,86,87,88,89],"FPGA PCB","FPGA Board Layout","BGA Breakout Routing","FPGA Power Integrity","SERDES Channel PCB","DDR4 FPGA Layout","Xilinx Versal Board","Intel Agilex PCB","Via-in-Pad FPGA","FPGA Decoupling Strategy","Multi-Gigabit Transceiver Board","Back-Drill FPGA Via","LVDS Differential Routing","Kintex UltraScale Board","FPGA Thermal Via Array","HDI BGA Escape Routing","FPGA Development Board PCB",{"id":91,"slug":91,"title":92,"description":93,"date":94,"category":10,"image":95,"featured":12,"tags":96,"readingTime":34,"year":20,"month":21},"hbm3-interposer-quality","HBM3 interposer PCB quality: Managing advanced packaging and high-speed interconnect challenges for AI chip interconnect and substrate PCBs","A closer look at HBM3 interposer PCB quality, covering high-speed signal integrity, thermal management, and power/interconnect design to help you build high-performance AI chip interconnect and substrate PCBs.","2026-03-07","/assets/img/blogs/2025/11/microvias-pcb.webp",[97,98,99,100,101,102],"HBM3 interposer PCB quality","HBM3 interposer PCB","HBM3 interposer PCB checklist","HBM3 interposer PCB quick turn","HBM3 interposer PCB reliability","low-loss HBM3 interposer PCB",{"id":104,"slug":104,"title":105,"description":106,"date":94,"category":10,"image":107,"featured":12,"tags":108,"readingTime":116,"year":20,"month":21},"lidar-interface-board-assembly","LiDAR Interface Board Assembly: NPI and Test Guide","LiDAR interface board assembly guide covering mixed-signal partitioning, HDI and rigid-flex decisions, process controls, validation gates, and RFQ evidence.","/assets/img/blogs/2025/11/adas-pcb.webp",[109,110,111,112,113,114,115],"LiDAR","Automotive Electronics","PCB Assembly","Mixed-Signal Design","HDI PCB","Rigid-Flex PCB","NPI",14,{"id":118,"slug":118,"title":119,"description":120,"date":94,"category":10,"image":121,"featured":12,"tags":122,"readingTime":34,"year":20,"month":21},"split-plane-design-guide","Split Plane Design Guide: A Practical PCB Design Primer from Concept to Layout","This split plane design guide explains PCB design thinking, stackup planning, routing strategy, and DRC checkpoints with practical checklists and examples to help new engineers get started quickly.","/assets/img/blogs/2025/09/pcb-design.webp",[123,124,125,126,127,128],"split plane design guide","differential pair basics","drc rule template pcb","guard trace design","mixed signal pcb layout","pcb documentation tutorial",{"id":130,"slug":130,"title":131,"description":132,"date":94,"category":10,"image":133,"featured":12,"tags":134,"readingTime":34,"year":20,"month":21},"three-phase-inverter-control","Three-phase inverter control PCB manufacturing: The core of validation and consistency in renewable energy","A deep dive into three-phase inverter control PCB manufacturing, exploring HIL testing, EOL verification, reliability, and mass production consistency for renewable energy systems.","/assets/img/blogs/2025/11/solar-inverter-pcb-manufacturing.webp",[135,136,137,138,139,140],"Three-phase inverter control PCB manufacturing","Three-phase inverter control PCB validation","Three-phase inverter control PCB routing","Three-phase inverter control PCB reliability","Three-phase inverter control PCB quick turn","Three-phase inverter control PCB low volume",{"id":142,"slug":142,"title":143,"description":144,"date":145,"category":10,"image":146,"featured":12,"tags":147,"readingTime":155,"year":20,"month":21},"phase-consistency-routing","PCB Phase Consistency Routing for mmWave RF","Design PCB phase consistency routing for mmWave arrays with electrical-length budgets, stackup tolerances, via models, VNA verification, and an RFQ checklist.","2026-03-05","/assets/img/blogs/2025/11/mmwave-pcb-manufacturing.webp",[148,149,150,151,152,153,154],"RF PCB Design","Phase Matching","mmWave PCB","Phased Array","Controlled Impedance","Group Delay","5G Hardware",21,{"id":157,"slug":157,"title":158,"description":159,"date":145,"category":69,"image":160,"featured":71,"tags":161,"readingTime":34,"year":20,"month":21},"smart-meter-pcb","Smart Meter PCB for AMI Networks, Tamper Detection, and 20-Year Field Life","Smart meter PCB covering metrology-grade analog front ends, PLC and NB-IoT communication, anti-tamper hardware, high-voltage isolation, and 20-year reliability.","/assets/img/blogs/2026/03/smart-meter-pcb.webp",[162,163,164,165,166,167,168,169,170,171,172,173,174,175,176,177,178],"Smart Meter PCB","Electric Meter Circuit Board","AMI Meter PCB Design","Energy Meter Board Layout","Power Line Communication PCB","NB-IoT Smart Meter Board","Metrology PCB Front End","Tamper Detection Meter Board","Three-Phase Meter PCB","Prepaid Meter Circuit Board","Water Meter Electronics PCB","Gas Meter PCB Design","Revenue Metering Board","Current Transformer Meter PCB","Smart Grid Circuit Board","DLMS Protocol Meter Board","Utility Meter PCB Manufacturing",{"id":180,"slug":180,"title":181,"description":182,"date":183,"category":10,"image":184,"featured":12,"tags":185,"readingTime":34,"year":20,"month":21},"48v-12v-conversion-quality","48V to 12V Conversion Board Design Guide: Thermal Management, PCB Materials, and Power Reliability","Learn how to improve 48V to 12V conversion board quality with thermal design strategies, heavy copper PCB materials, thermal vias, cooling selection, simulation validation, and manufacturing controls for high-power data center and HPC applications.","2026-03-03","/assets/img/blogs/2025/10/power-pcb.webp",[186,187,188,189,190,191],"48V to 12V conversion board quality","48V to 12V conversion board low volume","48V to 12V conversion board materials","data-center 48V to 12V conversion board","48V to 12V conversion board guide","48V to 12V conversion board design",1561,131,12,[10,69,196,197,198,199,200],"assembly","design","standards","materials","testing",[20,202],2025,1791854252098]