HILPCB operates one of China’s most advanced Rogers PCB factories, combining decades of high-frequency design expertise with fully automated manufacturing and testing systems. Our 50,000 m² facility specializes in producing Rogers-based circuit boards used in 5G base stations, automotive radar, aerospace avionics, and microwave systems, ensuring unmatched precision, reliability, and repeatability.
From material storage to final testing, every process is designed around the unique requirements of Rogers and hybrid PTFE-based laminates, guaranteeing consistent dielectric performance and superior mechanical stability.
Inside HILPCB’s Rogers PCB Manufacturing Facility
Our Rogers PCB factory integrates cleanroom-grade fabrication environments, precision automation, and complete traceability systems.
- Cleanroom zones (Class 10,000) prevent dust contamination during photolithography and lamination.
- Humidity- and temperature-controlled rooms ensure dimensional stability for rigid-flex PCB and hybrid PTFE processing.
- Refrigerated storage extends Rogers prepreg shelf life and maintains consistent resin properties.
- ESD-protected assembly areas safeguard sensitive components during handling.
- Dedicated Rogers lines separate PTFE materials from FR4 PCB processes to prevent cross-contamination.
Every production stage — from material preparation to lamination — follows HILPCB’s documented workflow for high-frequency PCB fabrication.
Advanced Equipment and Production Capabilities
HILPCB’s Rogers PCB factory features precision drilling, lamination, and imaging systems optimized for high-frequency performance.
Drilling and Imaging Systems
- High-speed drilling spindles (up to 200,000 RPM) for microvia and blind-via accuracy.
- Controlled-depth drilling supports HDI and multilayer PCB builds.
- Direct imaging systems eliminate alignment errors and achieve 50–75 µm trace/space geometries.
- Automatic optical alignment keeps layer registration within ±25 µm for high-speed PCB applications.
Lamination and Plating
- Vacuum-assisted presses eliminate voids and improve resin flow during bonding.
- Sequential lamination enables stacked via HDI PCB configurations.
- Controlled cooling prevents stress and warpage in multi-material stackups.
- Copper filling provides uniform plating for buried via and hybrid stack designs.
This advanced equipment supports both prototype and volume production with consistent dimensional accuracy and RF integrity.
Advanced Thermal and Signal Integrity Management in Rogers PCB Manufacturing
As frequency and power demands rise, thermal management and signal integrity become critical to the success of Rogers PCB designs. At HILPCB, our engineering approach combines simulation, materials science, and process control to ensure that every Rogers board maintains stable performance across temperature, frequency, and environmental extremes.
Thermal Management Engineering
Rogers laminates such as RO4350B and TMM10i have unique heat dissipation characteristics that require controlled stack-up design. Our engineers apply multi-level heat management strategies:
- Pre-layout thermal simulation: Identifies local hot zones before layout.
- Optimized copper thickness: Heavy-copper zones (up to 6 oz) for power amplifiers and high-thermal PCB designs.
- Thermal via arrays: Dense copper vias transfer heat from high-power devices to internal planes.
- Hybrid material integration: Combining TMM cores with metal-core PCB for enhanced heat spreading.
- Laminate CTE matching: Prevents delamination during reflow or environmental cycling.
Each design undergoes thermal cycling tests (−40 °C to +150 °C) to ensure mechanical and electrical reliability over extended operation.
Signal Integrity and Electrical Optimization
At frequencies above 10 GHz, even minimal signal reflections can cause loss or distortion. HILPCB addresses these challenges through precision design and process control:
- Controlled impedance modeling across differential pairs and microstrip lines.
- Tight dielectric control using plasma surface treatment before bonding.
- Low-loss copper foils for reduced conductor roughness and improved phase stability.
- Backdrilling techniques to remove stubs and minimize insertion loss in high-speed PCB structures.
- RF validation testing: TDR, S-parameter, and insertion-loss verification using vector network analyzers.
This integrated methodology guarantees clean, stable signals across complex multi-layer and mixed-material designs.
Rigorous Quality Control at Every Stage
HILPCB enforces comprehensive inspection and testing procedures to ensure reliability from material incoming to shipment.
In-Process Inspection
- Dielectric constant and thickness verification of incoming materials.
- Automated optical inspection (AOI) after imaging and etching.
- Cross-section and microvia analysis confirming plating uniformity.
- Statistical process control maintaining key tolerances and yield metrics.
Final Validation
- Electrical continuity and isolation tests for 100% of boards.
- Controlled impedance verification using time-domain reflectometry.
- Environmental and humidity stress testing for aerospace and automotive boards.
- Full documentation package including certificates, photos, and test data supporting SMT assembly or box-build assembly.
This layered QC framework ensures zero-defect quality and repeatable manufacturing performance.
Customer Collaboration and Global Support
HILPCB provides complete engineering and supply chain support for global OEMs and EMS providers.
- Design and material consulting: Rogers laminate selection, stack-up optimization, and DFM review.
- Prototype and production scalability: From R&D samples to small-batch assembly and large-volume assembly.
- Order transparency: Digital MES and ERP systems provide live production status.
- Worldwide logistics: Export packaging, customs management, and delivery tracking.
Our integrated workflow shortens time-to-market while maintaining strict quality and cost efficiency.
Partner with HILPCB – Your Trusted Rogers PCB Manufacturer
At HILPCB, we understand that choosing the right manufacturing partner is about more than technical capability — it’s about confidence, reliability, and long-term value. With a dedicated focus on high-frequency and microwave PCB fabrication, we provide engineering-driven solutions that support your innovation from concept to deployment.
Why Engineers and OEMs Choose HILPCB
- Unmatched Technical Expertise: Our engineers specialize in Rogers, TMM, and hybrid material processing, supporting RF, radar, satellite, and 5G applications requiring extreme precision.
- Integrated Manufacturing and Assembly: We combine PCB fabrication, SMT assembly, and turnkey production under one roof to ensure seamless control from design to final product.
- End-to-End Quality Assurance: Each board undergoes electrical, impedance, and reliability validation in accordance with IPC Class 3 and IATF 16949 standards, guaranteeing stable performance in critical environments.
- Material and Design Consultation: Our engineering team works directly with your designers to optimize stack-ups, minimize losses, and balance cost with performance using verified Rogers and Teflon laminates.
- Global Logistics and Support: HILPCB’s international shipping and inventory systems provide short lead times and full traceability, enabling smooth integration into your global supply chain.
Beyond Manufacturing – A Long-Term Technical Partner
HILPCB is not just a board manufacturer — we are your engineering collaborator. Our R&D programs continually enhance process control, simulation accuracy, and thermal management technology for the next generation of high-frequency products. We support industries including aerospace, automotive radar, defense electronics, medical imaging, and high-speed networking, adapting to evolving design requirements with agility and precision.
Our goal is to help customers accelerate product development, reduce rework cycles, and achieve first-pass success in every build. With hundreds of successful global deployments and a proven record of quality, HILPCB stands as one of China’s most trusted Rogers PCB manufacturers.