[{"data":1,"prerenderedAt":71},["ShallowReactive",2],{"blog-what-is-a-bom-en":3},{"title":4,"description":5,"date":6,"lastUpdated":6,"category":7,"image":8,"readingTime":9,"wordCount":10,"timeRequired":11,"htmlContent":12,"faq":13,"tags":30,"slug":39,"sourceLocale":40,"availableLocales":41,"jsonld":47},"What Is a BOM in Electronics Manufacturing? PCBA BOM Format, Sample Table, and Sourcing Rules","Prepare a PCBA BOM with quantities, designators, exact orderable parts, approved alternates, variants and sourcing responsibility. Use the sample and release checks to prevent ambiguous orders.","2026-10-15","technology",null,14,2675,"PT14M","\u003Cp>A PCBA BOM connects the approved component selection to purchasing and assembly. Missing orderable part details, inconsistent designators or an unclear build variant can stop quotation or production. Check the BOM against the schematic, placement data and assembly drawing before ordering; no universal percentage of engineering queries is attributed to BOM errors here.\u003C/p>\n\u003Cp>Use the structured sample, discrepancy checklist and release responsibilities below to identify what must be approved before the supplier buys or fits components.\u003C/p>\n\u003Ch2>What is a BOM in manufacturing, and how do EBOM and MBOM differ?\u003C/h2>\n\u003Cp>If you are asking what is a BOM in manufacturing, the BOM full form is Bill of Materials: the master structured list of every raw material, semiconductor, passive component, sub-assembly, and mechanical fastener required to build a finished product. In printed circuit board assembly, the BOM acts as a controlled instruction set that links your schematic netlist and pick-and-place centroid file (\u003Ccode>XYR\u003C/code>) to warehouse kitting, automated optical inspection (AOI), and purchasing.\u003C/p>\n\u003Cp>Hardware teams frequently run into production holds when they submit an early Engineering BOM (EBOM) exported straight from ECAD software when the factory actually needs a Manufacturing BOM (MBOM). Depending on product complexity, teams also choose between two distinct BOM structures: a single-level BOM structure (which lists only the parts soldered onto one PCBA) and a multi-level BOM structure (an indented hierarchy that nests the bare PCB fabrication specification, sub-assembly boards, cable harnesses, conformal coating, enclosure plastics, and packaging materials under a top-level box-build parent item).\u003C/p>\n\u003Ctable>\n\u003Cthead>\n\u003Ctr>\n\u003Cth>BOM Type / Structure\u003C/th>\n\u003Cth>Primary Owner\u003C/th>\n\u003Cth>What It Contains\u003C/th>\n\u003Cth>Typical Blind Spot If Used Alone for Production\u003C/th>\n\u003C/tr>\n\u003C/thead>\n\u003Ctbody>\u003Ctr>\n\u003Ctd>Engineering BOM (EBOM)\u003C/td>\n\u003Ctd>Hardware / Layout Engineer\u003C/td>\n\u003Ctd>RefDes, electrical values, package footprints, primary MPNs exported from Altium, OrCAD, or KiCad\u003C/td>\n\u003Ctd>Often omits bare PCB part number, approved alternates (AVL), packaging carrier suffixes, and mechanical hardware\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Manufacturing BOM (MBOM)\u003C/td>\n\u003Ctd>NPI / Manufacturing Engineer\u003C/td>\n\u003Ctd>Complete EBOM data plus bare PCB fab spec, solder paste/glue consumables, panel attrition overage, programming firmware ID, and DNI flags\u003C/td>\n\u003Ctd>Requires synchronization with schematic revisions through formal Engineering Change Orders (ECOs)\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Single-Level BOM Structure\u003C/td>\n\u003Ctd>Prototype & PCBA Buyers\u003C/td>\n\u003Ctd>Flat table of components directly populated onto a single circuit board assembly\u003C/td>\n\u003Ctd>Cannot represent parent-child dependencies across multi-board products, wire harnesses, or final enclosure assembly\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Multi-Level BOM Structure\u003C/td>\n\u003Ctd>Box-Build / System Ops\u003C/td>\n\u003Ctd>Indented parent-child tree (Level 0 system -> Level 1 PCBA & chassis -> Level 2 bare PCB & SMT components)\u003C/td>\n\u003Ctd>Overly complex for standalone PCBA quoting if sub-assemblies are not clearly separated by build stage\u003C/td>\n\u003C/tr>\n\u003C/tbody>\u003C/table>\n\u003Cp>Before exporting files for quotation, align the EBOM and MBOM so that every intentionally unfitted component position is identified in the released variant as \u003Ccode>DNI\u003C/code> (Do Not Install) or an agreed equivalent and every mechanical item (heatsinks, standoffs, thermal pads, screws) has an explicit mounting assignment. When your project requires schematic capture or footprint scrubbing prior to release, our \u003Ca href=\"/en/services/pcb-design/\">PCB design services\u003C/a> team can standardize your library and BOM structure before fabrication begins.\u003C/p>\n\u003Ch2>Example BOM: what a production-ready PCBA BOM sample looks like\u003C/h2>\n\u003Cp>An editable BOM should give purchasing and assembly unambiguous identifiers. The following \u003Cstrong>illustrative six-line example is not a released design or an approved substitution list\u003C/strong>. Named catalog candidates demonstrate identifier formatting; project requirements, package compatibility, handling and alternates still need design approval.\u003C/p>\n\u003Ctable>\n\u003Cthead>\n\u003Ctr>\n\u003Cth>Item\u003C/th>\n\u003Cth>Fitted Qty / Board\u003C/th>\n\u003Cth>RefDes\u003C/th>\n\u003Cth>Assumed design requirement\u003C/th>\n\u003Cth>Package / drawing\u003C/th>\n\u003Cth>Manufacturer / owner\u003C/th>\n\u003Cth>Identifier\u003C/th>\n\u003Cth>Alternate approval\u003C/th>\n\u003Cth>Build / sourcing\u003C/th>\n\u003Cth>Release note\u003C/th>\n\u003C/tr>\n\u003C/thead>\n\u003Ctbody>\u003Ctr>\n\u003Ctd>1\u003C/td>\n\u003Ctd>1\u003C/td>\n\u003Ctd>\u003Ccode>U1\u003C/code>\u003C/td>\n\u003Ctd>MCU selection for the example design\u003C/td>\n\u003Ctd>LQFP-100; verify exact drawing\u003C/td>\n\u003Ctd>STMicroelectronics\u003C/td>\n\u003Ctd>\u003Ccode>STM32F407VET6TR\u003C/code>\u003C/td>\n\u003Ctd>None approved in this example\u003C/td>\n\u003Ctd>SMT / turnkey\u003C/td>\n\u003Ctd>Verify pin mapping, supply, firmware and part-specific handling\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>2\u003C/td>\n\u003Ctd>14\u003C/td>\n\u003Ctd>\u003Ccode>C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14\u003C/code>\u003C/td>\n\u003Ctd>Example: 0.1 µF, 25 V, X7R, ±10%\u003C/td>\n\u003Ctd>0402 imperial / 1005 metric\u003C/td>\n\u003Ctd>Murata candidate\u003C/td>\n\u003Ctd>\u003Ccode>GRM155R71E104KA88D\u003C/code>\u003C/td>\n\u003Ctd>None approved in this example\u003C/td>\n\u003Ctd>SMT / turnkey\u003C/td>\n\u003Ctd>Verify exact ordering data and capacitance under the actual bias/temperature\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>3\u003C/td>\n\u003Ctd>6\u003C/td>\n\u003Ctd>\u003Ccode>R1, R2, R3, R4, R5, R6\u003C/code>\u003C/td>\n\u003Ctd>Example: 10 kΩ, ±1%\u003C/td>\n\u003Ctd>0402 imperial / 1005 metric\u003C/td>\n\u003Ctd>YAGEO\u003C/td>\n\u003Ctd>\u003Ccode>RC0402FR-0710KL\u003C/code>\u003C/td>\n\u003Ctd>None approved in this example\u003C/td>\n\u003Ctd>SMT / turnkey\u003C/td>\n\u003Ctd>Check rated power, voltage, temperature and termination for the circuit\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>4\u003C/td>\n\u003Ctd>0 in MP; 1 in EVT\u003C/td>\n\u003Ctd>\u003Ccode>J2\u003C/code>\u003C/td>\n\u003Ctd>Ten-position debug header\u003C/td>\n\u003Ctd>1 × 10, 2.54 mm pitch; verify drawing\u003C/td>\n\u003Ctd>Samtec\u003C/td>\n\u003Ctd>\u003Ccode>TSW-110-07-G-S\u003C/code>\u003C/td>\n\u003Ctd>None approved in this example\u003C/td>\n\u003Ctd>THT / variant-controlled\u003C/td>\n\u003Ctd>DNP in MP; populate only on the released EVT variant\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>5\u003C/td>\n\u003Ctd>4\u003C/td>\n\u003Ctd>\u003Ccode>MP1, MP2, MP3, MP4\u003C/code>\u003C/td>\n\u003Ctd>Mechanical supports\u003C/td>\n\u003Ctd>Customer drawing \u003Ccode>MECH-STANDOFF-REV-A\u003C/code>\u003C/td>\n\u003Ctd>Customer-controlled item\u003C/td>\n\u003Ctd>\u003Ccode>MECH-STANDOFF-REV-A\u003C/code>\u003C/td>\n\u003Ctd>Per approved drawing\u003C/td>\n\u003Ctd>Mechanical / scope agreed\u003C/td>\n\u003Ctd>Drawing must define dimensions, material, finish and installation limits\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>6\u003C/td>\n\u003Ctd>1\u003C/td>\n\u003Ctd>\u003Ccode>PCB1\u003C/code>\u003C/td>\n\u003Ctd>Bare board for this example\u003C/td>\n\u003Ctd>Drawing \u003Ccode>DWG-CTRL-03.pdf\u003C/code>\u003C/td>\n\u003Ctd>Customer-controlled board\u003C/td>\n\u003Ctd>\u003Ccode>PCB-CTRL-REV-C\u003C/code>\u003C/td>\n\u003Ctd>No unapproved construction change\u003C/td>\n\u003Ctd>Bare board / fabrication\u003C/td>\n\u003Ctd>Drawing controls stackup, finish, acceptance and revision\u003C/td>\n\u003C/tr>\n\u003C/tbody>\u003C/table>\n\u003Cp>ST’s \u003Ca href=\"https://www.st.com/en/microcontrollers-microprocessors/stm32f407ve.html\">product page\u003C/a> identifies the MCU ordering variant and LQFP-100 package; the \u003Ca href=\"https://yageogroup.com/component-documentation/download/specsheet/RC0402FR-0710KL\">YAGEO part record\u003C/a> and \u003Ca href=\"https://www.samtec.com/products/tsw-110-07-g-s\">Samtec configuration\u003C/a> provide part-specific data. Those examples do not qualify the assembled circuit. Recheck current ordering data before buying any candidate.\u003C/p>\n\u003Cp>Four formatting checks make the sample useful:\u003C/p>\n\u003Col>\n\u003Cli>Expand designators or use an import convention explicitly accepted by the supplier; do not let a range hide skipped numbers.\u003C/li>\n\u003Cli>Compare quantities and designators for the selected fitted variant. A DNP row can retain a designator while its fitted quantity is zero.\u003C/li>\n\u003Cli>Approve each alternate through electrical, pinout, package, thermal, process and software review where relevant; a shared footprint or value is insufficient.\u003C/li>\n\u003Cli>Keep intentional omissions explicit in the variant or agreed DNP convention. Use the \u003Ca href=\"/en/tools/bom-viewer/\">BOM viewer\u003C/a> as a data-checking aid, not proof of component suitability.\u003C/li>\n\u003C/ol>\n\u003Ch2>Which MPN suffix and passive specs cause SMT line holds?\u003C/h2>\n\u003Cp>Use the manufacturer’s full orderable identifier and keep distributor SKUs in a separate field. A base number may itself be a valid ordering option; the task is to select the correct package, grade and packing for the approved design and assembly process.\u003C/p>\n\u003Cul>\n\u003Cli>\u003Cstrong>Packing:\u003C/strong> Reel, cut tape, tube, tray and bulk handling differ. Agree carrier dimensions, leaders/trailers and any re-reeling requirements with the assembler; there is no universal 30 cm leader for all parts and feeders.\u003C/li>\n\u003Cli>\u003Cstrong>Distributor versus manufacturer number:\u003C/strong> Preserve both when useful, with clear field names. Distributor packing options do not necessarily change the underlying device, but they can change receiving and setup work.\u003C/li>\n\u003Cli>\u003Cstrong>Grade and temperature:\u003C/strong> Read the specific manufacturer’s ordering table. Commercial, industrial and automotive labels do not imply one universal temperature range, and AEC qualification is not established solely by a −40 to +125°C range.\u003C/li>\n\u003Cli>\u003Cstrong>Passive behavior:\u003C/strong> Specify voltage, tolerance, dielectric and application-relevant limits. MLCC capacitance can change with DC bias, temperature and aging; use the exact part’s data instead of assigning every X5R capacitor a fixed 60% loss. Confirm the regulator’s required effective capacitance and stability conditions.\u003C/li>\n\u003C/ul>\n\u003Ch2>How do CAM and IQC teams audit BOM material against centroid and Gerber files?\u003C/h2>\n\u003Cp>Before any BOM material is released to the SMT line, manufacturing engineers cross-check the spreadsheet against the Gerber copper layers (\u003Ccode>GTL\u003C/code>/\u003Ccode>GBL\u003C/code>), paste mask (\u003Ccode>GTP\u003C/code>/\u003Ccode>GBP\u003C/code>), and pick-and-place centroid file (\u003Ccode>XYR\u003C/code>). You can preview how your copper pads and silkscreen legends align with your component packages using our \u003Ca href=\"/en/tools/gerber-viewer/\">Gerber viewer\u003C/a>.\u003C/p>\n\u003Ctable>\n\u003Cthead>\n\u003Ctr>\n\u003Cth>Audit Failure Signature\u003C/th>\n\u003Cth>Production Impact if Uncaught\u003C/th>\n\u003Cth>Root Cause in BOM / CAD Files\u003C/th>\n\u003Cth>Detection Gate\u003C/th>\n\u003Cth>Corrective Action\u003C/th>\n\u003C/tr>\n\u003C/thead>\n\u003Ctbody>\u003Ctr>\n\u003Ctd>Footprint-to-MPN Package Mismatch\u003C/td>\n\u003Ctd>IC leads overhang pads or cannot solder; full board rework\u003C/td>\n\u003Ctd>BOM and layout call out different package families or variants; exact body, pitch and pin mapping do not agree\u003C/td>\n\u003Ctd>Pre-production DFM / DFA cross-check\u003C/td>\n\u003Ctd>Verify datasheet mechanical drawing against CAD land pattern per \u003Ca href=\"/en/blog/ipc-7351-land-pattern-standard/\">IPC-7351 land pattern standards\u003C/a>\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Pin-1 & Zero-Degree Rotation Offset\u003C/td>\n\u003Ctd>Polarized diodes, tantalum caps, or QFNs placed rotated 90° or 180°\u003C/td>\n\u003Ctd>CAD library, packing and supplier import use different origin, side or rotation conventions\u003C/td>\n\u003Ctd>First-Article Inspection (FAI) & CAM visual overlay\u003C/td>\n\u003Ctd>Include an assembly drawing with explicit Pin-1 dots and diode cathode bars outside component bodies\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Moisture Sensitivity (MSL) Omission\u003C/td>\n\u003Ctd>Plastic IC package delamination or internal wire-bond "popcorning" at 260 °C reflow\u003C/td>\n\u003Ctd>Moisture-sensitive packages supplied without the required rating, exposure or handling records\u003C/td>\n\u003Ctd>Incoming Quality Control (IQC) humidity indicator check\u003C/td>\n\u003Ctd>Log MSL rating in BOM notes; assess package-specific floor-life/exposure and apply the approved J-STD-033 handling or drying process when required\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>NRND / EOL Obsolescence Surprise\u003C/td>\n\u003Ctd>Build stalls between EVT and PVT; forced board respin or broker grey-market risk\u003C/td>\n\u003Ctd>Schematic reuses legacy CAD library symbol without checking current manufacturer lifecycle status\u003C/td>\n\u003Ctd>Automated BOM scrub during quotation\u003C/td>\n\u003Ctd>Review lifecycle and supply options; validate any alternate’s electrical, pinout, package, software and qualification effects before approval\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Unapproved BOM Materials Substitution\u003C/td>\n\u003Ctd>RF impedance shift, thermal trip, or safety certification invalidation\u003C/td>\n\u003Ctd>Unauthorized swap of critical inductor Q-factor, current-sense resistor TCR, or UL-listed fuse\u003C/td>\n\u003Ctd>IQC LCR meter & label verification against AVL\u003C/td>\n\u003Ctd>Mark safety-critical and RF-tuned rows as \u003Ccode>"Do Not Substitute"\u003C/code> in the BOM\u003C/td>\n\u003C/tr>\n\u003C/tbody>\u003C/table>\n\u003Ch2>Turnkey vs. consigned electronic BOM sourcing and attrition overage\u003C/h2>\n\u003Cp>Procurement teams ordering assembled boards typically select between Full Turnkey (the EMS factory procures all BOM materials and bare PCBs), Consigned / Kitted (the customer ships components to the factory), or Hybrid / Partial Turnkey (the factory sources standard passives, connectors, and active ICs while the customer consigns proprietary ASICs or pre-programmed modules).\u003C/p>\n\u003Cp>For consigned or hybrid builds, separate the net fitted quantity from setup, attrition, inspection and spare needs. Agree the allowance by line item with the assembler and record setup, test and spare needs before shipping the kit.\u003C/p>\n\u003Ctable>\n\u003Cthead>\n\u003Ctr>\n\u003Cth>Component group\u003C/th>\n\u003Cth>Handling inputs\u003C/th>\n\u003Cth>Allowance decision\u003C/th>\n\u003Cth>Record before shipment\u003C/th>\n\u003C/tr>\n\u003C/thead>\n\u003Ctbody>\u003Ctr>\n\u003Ctd>Small chip passives\u003C/td>\n\u003Ctd>Carrier, setup losses and available reels\u003C/td>\n\u003Ctd>Supplier-agreed quantity per line\u003C/td>\n\u003Ctd>Net demand, setup allowance and remaining stock ownership\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Standard passives/discretes\u003C/td>\n\u003Ctd>Feeder and packing compatibility\u003C/td>\n\u003Ctd>Actual lot size and setup needs\u003C/td>\n\u003Ctd>Approved count and packing\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Connectors/magnetics\u003C/td>\n\u003Ctd>Tray/tube/reel, nozzle and handling\u003C/td>\n\u003Ctd>Part-specific damage/setup/spare risk\u003C/td>\n\u003Ctd>Packaging and spare disposition\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>Standard ICs\u003C/td>\n\u003Ctd>Package handling and moisture controls\u003C/td>\n\u003Ctd>Setup and test needs without arbitrary waste\u003C/td>\n\u003Ctd>Exact MPN, lot, quantity and handling records\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>High-value/custom devices\u003C/td>\n\u003Ctd>Placement, rework and destructive-test plan\u003C/td>\n\u003Ctd>Agree any spare or sacrificial units explicitly\u003C/td>\n\u003Ctd>Ownership, permitted rework and unused-material return\u003C/td>\n\u003C/tr>\n\u003C/tbody>\u003C/table>\n\u003Cp>As an \u003Cstrong>assumed purchasing example\u003C/strong>, 50 boards using 10 parts each need 500 fitted parts. If the assembler and customer agree 20 setup parts and 10 contingency parts, the shipment is \u003Ccode>500 + 20 + 10 = 530\u003C/code>. Those allowances are not a HILPCB standard or a percentage recommendation; confirm the actual kit before dispatch.\u003C/p>\n\u003Cp>For turnkey and hybrid builds, agree authorized-source rules, lot traceability and required material/compliance records across our \u003Ca href=\"/en/products/turnkey-assembly/\">turnkey PCB assembly\u003C/a> and \u003Ca href=\"/en/products/smt-assembly/\">SMT assembly\u003C/a> lines (specific lead times, AVL cross-references, and kitting requirements are confirmed at quotation).\u003C/p>\n\u003Ch2>Submit / Release Aid\u003C/h2>\n\u003Cp>\u003Cstrong>Send with the RFQ or release package:\u003C/strong>\u003C/p>\n\u003Col>\n\u003Cli>Editable \u003Ccode>.xlsx\u003C/code> or \u003Ccode>.csv\u003C/code> BOM file containing the 10–12 core columns (Item, Qty, unpacked RefDes, Description, Package, Manufacturer, complete MPN, AVL Alternates, Mount/Sourcing type, and DNI/MSL notes).\u003C/li>\n\u003Cli>Gerber (\u003Ccode>RS-274X\u003C/code> or \u003Ccode>Gerber X2\u003C/code>) or \u003Ccode>ODB++\u003C/code> / \u003Ccode>IPC-2581\u003C/code> fabrication archive plus NC Drill files.\u003C/li>\n\u003Cli>Pick-and-Place centroid file (\u003Ccode>XYR\u003C/code> CSV/ASCII) with RefDes, layer, X/Y coordinates, and rotation angle matching the BOM.\u003C/li>\n\u003Cli>Assembly drawing (\u003Ccode>.pdf\u003C/code>) showing component outlines, Pin-1 polarity marks, special torque/adhesives, and any \u003Ccode>DNI\u003C/code> positions.\u003C/li>\n\u003C/ol>\n\u003Cp>\u003Cstrong>Request from the supplier (evidence you need before sign-off):\u003C/strong>\u003C/p>\n\u003Col>\n\u003Cli>Automated BOM scrub report flagging any NRND/EOL lifecycle alerts, long-lead-time bottlenecks, or MPN-to-footprint mismatches.\u003C/li>\n\u003Cli>Written Alternate Part Request (APR) sheet with electrical/package comparison for any proposed passive or IC cross-reference before purchasing.\u003C/li>\n\u003Cli>DFM / DFA engineering query (EQ) log verifying pad-to-lead geometry, stencil aperture ratios, and Pin-1 rotation alignment.\u003C/li>\n\u003Cli>First-Article Inspection (FAI) report with LCR passive measurements, high-resolution AOI/X-ray images, and lot traceability log at the agreed first-article release gate.\u003C/li>\n\u003C/ol>\n\u003Cp>\u003Cstrong>Owner for each step:\u003C/strong>\u003C/p>\n\u003Cul>\n\u003Cli>Designer: Lock EBOM-to-schematic netlist parity, specify voltage/tolerance/dielectric ratings on passives, and mark all \u003Ccode>DNI\u003C/code> designators.\u003C/li>\n\u003Cli>Quality: Verify IPC-7351 footprint compatibility, define package-specific moisture handling and required material/compliance evidence, and sign off on FAI records.\u003C/li>\n\u003Cli>Procurement: Approve second-source AVL alternates, confirm Turnkey vs. Consigned attrition buffers, and lock component lead times.\u003C/li>\n\u003C/ul>\n\u003Cp>\u003Cstrong>Gate for verification (release decision by stage):\u003C/strong>\u003C/p>\n\u003Cul>\n\u003Cli>EVT: Netlist-to-BOM RefDes parity check + manual/automated FAI on the agreed first-article sample before powering rails.\u003C/li>\n\u003Cli>DVT: Full AVL alternate validation + MSL moisture control audit + X-ray and functional test verification.\u003C/li>\n\u003Cli>PVT: Verify the actual packing, feeder setup and placement program + locked MBOM revision under formal ECO change control.\u003C/li>\n\u003Cli>MP: Lot-by-lot IQC certificate of conformance (CoC) tracking + inline SPI, 3D AOI, and statistical yield monitoring.\u003C/li>\n\u003C/ul>\n\u003Cp>When your BOM spreadsheet, centroid data, and Gerber package are ready for pre-production verification, review our \u003Ca href=\"/en/products/turnkey-assembly/\">turnkey PCB assembly\u003C/a> workflow or upload your files to \u003Ca href=\"/en/quote/\">request a quote\u003C/a>.\u003C/p>\n\u003Cdiv data-component=\"BlogQuickQuoteInline\">\u003C/div>\n\n\u003C!-- faq:start -->\n\u003Ch3>What's a BOM, and what is the BOM full form in electronics?\u003C/h3>\n\u003Cp>BOM stands for Bill of Materials. In electronics manufacturing, an electronic BOM is the structured specification table that lists every component required to build a printed circuit board assembly, including exact quantities, Reference Designators (\u003Ccode>RefDes\u003C/code>), package footprints, manufacturer names, complete orderable Manufacturer Part Numbers (MPNs), and approved alternates.\u003C/p>\n\u003Ch3>Why should a PCBA BOM be submitted in Excel or CSV format instead of a PDF?\u003C/h3>\n\u003Cp>An editable BOM supports purchasing imports and cross-checks with placement data; the placement file and assembly drawing provide additional programming inputs. Submitting an \u003Ccode>.xlsx\u003C/code> or \u003Ccode>.csv\u003C/code> spreadsheet preserves exact text strings, whereas extracting tables from a PDF frequently drops hyphens, truncates long MPN suffixes, merges \u003Ccode>RefDes\u003C/code> cells, and delays quoting while engineers manually rebuild the file.\u003C/p>\n\u003Ch3>What is the difference between DNI, DNP, and NM on a circuit board BOM?\u003C/h3>\n\u003Cp>\u003Ccode>DNI\u003C/code> (Do Not Install), \u003Ccode>DNP\u003C/code> (Do Not Populate), and \u003Ccode>NM\u003C/code> (Not Mounted) all mean the same thing: the copper footprint exists on the bare PCB, but no component should be soldered onto those pads during assembly. Keep intentional omissions explicit in the agreed BOM/variant convention; for example, retain the \u003Ccode>DNI\u003C/code> row with a clear \u003Ccode>DNI\u003C/code> flag (or \u003Ccode>Qty = 0\u003C/code> with \u003Ccode>DNI\u003C/code> in the notes) rather than deleting them, so the assembly team knows the empty pads are intentional.\u003C/p>\n\u003Ch3>How do I handle bare PCBs, cables, and fasteners in a BOM structure?\u003C/h3>\n\u003Cp>In a complete Manufacturing BOM (MBOM) or multi-level BOM structure, the bare printed circuit board itself should appear as a dedicated line item (e.g., \u003Ccode>PCB1\u003C/code>, Qty \u003Ccode>1\u003C/code>, with the fabrication drawing part number and revision), alongside separate rows for mechanical fasteners, heatsinks, and cable assemblies. Clearly tag these rows as \u003Ccode>Mechanical\u003C/code> or \u003Ccode>Bare PCB\u003C/code> in the mounting column so SMT engineers separate them from automated pick-and-place feeder lists.\u003C/p>\n\u003C!-- faq:end -->\n\n\u003Cscript type=\"application/ld+json\">\n{\n  \"@context\": \"https://schema.org\",\n  \"@type\": \"TechArticle\",\n  \"headline\": \"What Is a BOM in Electronics Manufacturing? PCBA BOM Format, Sample Table, and Sourcing Rules\",\n  \"description\": \"Prepare a PCBA BOM with quantities, designators, exact orderable parts, approved alternates, variants and sourcing responsibility. Use the sample and release checks to prevent ambiguous orders.\",\n  \"datePublished\": \"2026-10-15\",\n  \"author\": {\n    \"@type\": \"Organization\",\n    \"name\": \"HilPCB\"\n  },\n  \"publisher\": {\n    \"@type\": \"Organization\",\n    \"name\": \"HilPCB\"\n  },\n  \"about\": {\n    \"@type\": \"Thing\",\n    \"name\": \"Bill of Materials (BOM)\"\n  },\n  \"keywords\": [\"what is a bom\", \"bom material\", \"example bom\", \"what is a bom in manufacturing\", \"whats a bom\", \"bom example\", \"bom sample\", \"bom bill of materials\", \"electronic bom\", \"bom materials\", \"bom structure\", \"bom structures\", \"bom full form\", \"bom format\", \"bom electronics\"]\n}\n\u003C/script>\n\u003Csection class=\"related-links\" aria-label=\"Related\">\u003Ch3>Related links\u003C/h3>\u003Cul>\u003Cli>\u003Ca href=\"/en/services/pcb-design/\">PCB design services\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/en/tools/bom-viewer/\">BOM viewer\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/en/tools/gerber-viewer/\">Gerber viewer\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/en/blog/ipc-7351-land-pattern-standard/\">IPC-7351 Land Pattern Standard: Density Levels, Solder Fillet Math, and DFM Footprint Rules\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/en/products/turnkey-assembly/\">turnkey PCB assembly\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/en/products/smt-assembly/\">SMT assembly\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/en/quote/\">request a quote\u003C/a>\u003C/li>\u003C/ul>\u003C/section>",[14,18,22,26],{"question":15,"answer":16,"answerText":17},"What's a BOM, and what is the BOM full form in electronics?","BOM stands for Bill of Materials. In electronics manufacturing, an electronic BOM is the structured specification table that lists every component required to build a printed circuit board assembly, including exact quantities, Reference Designators (`RefDes`), package footprints, manufacturer names, complete orderable Manufacturer Part Numbers (MPNs), and approved alternates.","BOM stands for Bill of Materials. In electronics manufacturing, an electronic BOM is the structured specification table that lists every component required to build a printed circuit board assembly, including exact quantities, Reference Designators (RefDes), package footprints, manufacturer names, complete orderable Manufacturer Part Numbers (MPNs), and approved alternates.",{"question":19,"answer":20,"answerText":21},"Why should a PCBA BOM be submitted in Excel or CSV format instead of a PDF?","An editable BOM supports purchasing imports and cross-checks with placement data; the placement file and assembly drawing provide additional programming inputs. Submitting an `.xlsx` or `.csv` spreadsheet preserves exact text strings, whereas extracting tables from a PDF frequently drops hyphens, truncates long MPN suffixes, merges `RefDes` cells, and delays quoting while engineers manually rebuild the file.","An editable BOM supports purchasing imports and cross-checks with placement data; the placement file and assembly drawing provide additional programming inputs. Submitting an .xlsx or .csv spreadsheet preserves exact text strings, whereas extracting tables from a PDF frequently drops hyphens, truncates long MPN suffixes, merges RefDes cells, and delays quoting while engineers manually rebuild the file.",{"question":23,"answer":24,"answerText":25},"What is the difference between DNI, DNP, and NM on a circuit board BOM?","`DNI` (Do Not Install), `DNP` (Do Not Populate), and `NM` (Not Mounted) all mean the same thing: the copper footprint exists on the bare PCB, but no component should be soldered onto those pads during assembly. Keep intentional omissions explicit in the agreed BOM/variant convention; for example, retain the `DNI` row with a clear `DNI` flag (or `Qty = 0` with `DNI` in the notes) rather than deleting them, so the assembly team knows the empty pads are intentional.","DNI (Do Not Install), DNP (Do Not Populate), and NM (Not Mounted) all mean the same thing: the copper footprint exists on the bare PCB, but no component should be soldered onto those pads during assembly. Keep intentional omissions explicit in the agreed BOM/variant convention; for example, retain the DNI row with a clear DNI flag (or Qty = 0 with DNI in the notes) rather than deleting them, so the assembly team knows the empty pads are intentional.",{"question":27,"answer":28,"answerText":29},"How do I handle bare PCBs, cables, and fasteners in a BOM structure?","In a complete Manufacturing BOM (MBOM) or multi-level BOM structure, the bare printed circuit board itself should appear as a dedicated line item (e.g., `PCB1`, Qty `1`, with the fabrication drawing part number and revision), alongside separate rows for mechanical fasteners, heatsinks, and cable assemblies. Clearly tag these rows as `Mechanical` or `Bare PCB` in the mounting column so SMT engineers separate them from automated pick-and-place feeder lists.","In a complete Manufacturing BOM (MBOM) or multi-level BOM structure, the bare printed circuit board itself should appear as a dedicated line item (e.g., PCB1, Qty 1, with the fabrication drawing part number and revision), alongside separate rows for mechanical fasteners, heatsinks, and cable assemblies. Clearly tag these rows as Mechanical or Bare PCB in the mounting column so SMT engineers separate them from automated pick-and-place feeder lists.",[31,32,33,34,35,36,37,38],"what is a bom","whats a bom","bom material","example bom","what is a bom in manufacturing","bom format","electronic bom","bom structure","what-is-a-bom","en",[40,42,43,44,45,46],"de","it","cn","fr","ru",{"blog":48,"breadcrumb":57},{"@context":49,"@type":50,"headline":4,"description":5,"url":51,"datePublished":6,"dateModified":6,"timeRequired":11,"keywords":52,"articleSection":7,"author":53,"publisher":56},"https://schema.org","BlogPosting","https://hilpcb.com/en/blog/what-is-a-bom/","what is a bom, whats a bom, bom material, example bom, what is a bom in manufacturing, bom format, electronic bom, bom structure",{"@type":54,"name":55},"Organization","HILPCB",{"@type":54,"name":55},{"@context":49,"@type":58,"itemListElement":59},"BreadcrumbList",[60,65,69],{"@type":61,"position":62,"name":63,"item":64},"ListItem",1,"Home","https://hilpcb.com/",{"@type":61,"position":66,"name":67,"item":68},2,"Blog","https://hilpcb.com/en/blog/",{"@type":61,"position":70,"name":39,"item":51},3,1792969676409]