[{"data":1,"prerenderedAt":167},["ShallowReactive",2],{"blog-initial-fr-26":3},{"posts":4,"totalPosts":159,"totalPages":160,"currentPage":161,"categories":162,"availableYears":165,"hasMore":12},[5,23,35,48,62,74,86,95,110,123,133,141],{"id":6,"slug":6,"title":7,"description":8,"date":9,"category":10,"image":11,"featured":12,"tags":13,"readingTime":20,"year":21,"month":22},"ai-server-motherboard-design-ai-server-backplane","Conception de PCB pour carte mère de serveur IA : maîtriser les interconnexions haut débit des fonds de panier","Guide technique sur la conception de PCB pour serveurs IA : empilage multicouche, intégrité du signal PCIe 5.0/6.0, réseau d’alimentation, dissipation thermique, DFM/DFT/DFA, fabrication et tests.","2025-12-17","technology",null,true,[14,15,16,17,18,19],"conception PCB carte mère serveur IA","revue DFM DFT DFA","test PCB carte mère serveur IA","test par sondes volantes","fabrication PCB serveur IA","production en série PCB serveur IA",8,2025,12,{"id":24,"slug":24,"title":25,"description":26,"date":9,"category":10,"image":27,"featured":12,"tags":28,"readingTime":20,"year":21,"month":22},"first-article-inspection-fai-high-speed-si-pcb-challenges","First Article Inspection (FAI) : maîtriser les ultra-high-speed links et le low-loss pour high-speed SI PCB","Deep dive First Article Inspection (FAI)—impedance/TDR, stackup/material Dk/Df, microsection vias, JTAG coverage et special processes—pour des high-speed SI PCB fiables.","/assets/img/blogs/pcb-first-article-inspection.webp",[29,30,31,32,33,34],"First Article Inspection (FAI)","DFM/DFT/DFA review","Turnkey PCBA","Boundary-Scan/JTAG","Conformal coating","Selective wave soldering",{"id":36,"slug":36,"title":37,"description":38,"date":9,"category":10,"image":39,"featured":40,"tags":41,"readingTime":20,"year":21,"month":22},"high-frequency-pcb-layer-stackup","Empilement de couches PCB haute fréquence : Optimisation de l'intégrité du signal et des performances","Guide complet sur la conception d'empilement de couches PCB haute fréquence incluant la sélection des matériaux, la planification d'impédance et le contrôle des EMI pour applications RF et numériques haute vitesse.","/assets/img/blogs/2025/12/high-frequency-pcb-layer-stackup.webp",false,[42,43,44,45,46,47],"Empilement de couches PCB haute fréquence","Conception d'empilement PCB","Intégrité du signal","Contrôle d'impédance","Empilement RF","Configuration des couches",{"id":49,"slug":49,"title":50,"description":51,"date":9,"category":52,"image":53,"featured":40,"tags":54,"readingTime":61,"year":21,"month":22},"material-loss-factor-hf-pcb","Facteur de pertes matériau en PCB HF : comprendre et minimiser l’atténuation du signal","Guide complet des facteurs de pertes matériau en PCB haute fréquence : pertes diélectriques et conducteurs, choix de tangente de pertes et stratégies de conception pour une atténuation minimale.","materials","/assets/img/blogs/2025/12/material-loss-factor-hf-pcb.webp",[55,56,57,58,59,60],"Pertes matériau","PCB haute fréquence","Tangente de pertes","Atténuation","Pertes diélectriques","Pertes conducteurs",10,{"id":63,"slug":63,"title":64,"description":65,"date":9,"category":10,"image":66,"featured":12,"tags":67,"readingTime":22,"year":21,"month":22},"reverse-light-led-lighting","Conception d’un PCB de feu de recul à LED automobile","Guide de conception d’un PCB de feu de recul : MCPCB, chaîne thermique, driver à courant constant, TVS, CEM, implantation optique, tests PCBA et dossier RFQ.","/assets/img/blogs/2025/12/reverse-light-pcb.webp",[68,69,70,71,72,73],"PCB feu de recul","PCB LED automobile","MCPCB aluminium","driver LED automobile","protection TVS automobile","PCBA éclairage automobile",{"id":75,"slug":75,"title":76,"description":77,"date":78,"category":10,"image":11,"featured":12,"tags":79,"readingTime":22,"year":21,"month":22},"battery-backup-datacenter-server","PCB de sauvegarde sur batterie pour data centers : intégrité de puissance, gestion thermique et fiabilité","Guide de conception et de fabrication des PCB de sauvegarde sur batterie pour data centers : cuivre épais, forts courants, intégrité des signaux, dissipation thermique et exigences de fiabilité IPC.","2025-12-16",[80,81,82,83,84,85],"PCB de sauvegarde sur batterie","PCB de baie d'alimentation","PCB PDU","PCB de micro data center","PCB pour refroidissement par immersion","PCB de supervision de data center",{"id":87,"slug":87,"title":88,"description":89,"date":78,"category":10,"image":90,"featured":12,"tags":91,"readingTime":20,"year":21,"month":22},"dfm-dft-dfa-review-power-cooling-pcb-challenges","DFM/DFT/DFA review : high power density et thermal challenges pour power & cooling system 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exceptionnelle et de faibles pertes diélectriques pour les systèmes haute fréquence, RF et micro-ondes.","/assets/img/blogs/2025/12/ptfe-circuit-board.webp",[129,56,130,131,132],"Circuit imprimé PTFE","PCB RF","PCB micro-ondes","PCB à faibles pertes",{"id":134,"slug":134,"title":135,"description":136,"date":78,"category":10,"image":11,"featured":12,"tags":137,"readingTime":140,"year":21,"month":22},"space-testing-aerospace-defense","PCB de Test Spatial : Les Normes Ultimes de Fiabilité et de Fabrication pour les Applications Aérospatiales","Découvrez comment les PCB de test spatial résistent au vide, aux radiations et aux températures extrêmes. 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