[{"data":1,"prerenderedAt":65},["ShallowReactive",2],{"blog-no-clean-flux-residue-it":3},{"title":4,"description":5,"date":6,"lastUpdated":6,"category":7,"image":8,"readingTime":9,"wordCount":10,"timeRequired":11,"htmlContent":12,"faq":13,"tags":29,"slug":34,"sourceLocale":35,"availableLocales":36,"jsonld":41},"No-Clean Flux Residue: When to Leave It, Clean It or Validate It","Decide when to retain no-clean flux residue, wash it, or apply conformal coating. Understand resin encapsulation physics, low-standoff QFN/BGA entrapment, and rework risks.","2026-10-28","technology","/assets/blogs/no-clean-flux-residue/05-residue-routes.svg",10,1839,"PT10M","\u003Cp>The designation \u003Cstrong>"no-clean" (typically J-STD-004 \u003Ccode>ROL0\u003C/code> or \u003Ccode>REL0\u003C/code>)\u003C/strong> does not mean a solder paste or liquid flux leaves zero residue on a finished PCBA, nor does it guarantee that the residue is harmless under every operating environment, rework procedure, or conformal coating system. Chemically, a no-clean flux relies on its \u003Cstrong>thermal history during soldering\u003C/strong>: as the board passes through a properly tuned reflow profile, volatile solvents evaporate and the remaining rosin or synthetic resin polymerizes into a hard, hydrophobic shell that encapsulates the weak organic acid (WOA) activators.\u003C/p>\n\u003Cp>When that protective resin shell is compromised—because low-standoff QFN/BGA bodies trapped unheated flux volatiles, because a technician applied extra tacky flux with a hand soldering iron, or because a conformal coating was sprayed directly over an incompatible flux fillet—the retained residue can trigger \u003Cstrong>electrochemical migration (dendritic growth), parasitic RF detuning, or coating delamination\u003C/strong>. For laboratory test methods (ROSE, Ion Chromatography, and SIR), see our \u003Ca href=\"/it/blog/cleanliness-testing-pcb-manufacturing-quality/\">PCB cleanliness testing guide\u003C/a>.\u003C/p>\n\u003Cp>\u003Cimg src=\"/assets/blogs/no-clean-flux-residue/05-residue-routes.svg\" alt=\"Engineering decision matrix for no-clean flux residue across retain, wash, coat over residue, and wash-then-coat routes\">\u003C/p>\n\u003Ch2>1. The Chemistry of No-Clean Flux: Why Thermal History and Product Scope Matter\u003C/h2>\n\u003Cp>Every flux must perform an aggressive chemical reaction during soldering—stripping metal oxides from copper pads and component terminations—and then become electrically benign once the joint cools. No-clean formulations achieve this balance only within their \u003Cstrong>validated process window\u003C/strong>:\u003C/p>\n\u003Cul>\n\u003Cli>\u003Cstrong>SMT Solder Paste vs. Wave Flux vs. Rework Tacky Flux Are Not Interchangeable:\u003C/strong> A board assembled with a low-residue no-clean SMT solder paste frequently encounters secondary fluxes during through-hole wave/selective soldering or manual bench touch-up. For instance, \u003Ca href=\"https://www.kester.com/downloads?Command=Core_Download&EntryId=3936\">Kester 951\u003C/a> is a low-solids, rosin-free no-clean liquid flux engineered specifically for wave soldering pallets where the entire board bottom passes over a preheater and molten solder wave. Conversely, \u003Ca href=\"https://www.chemtronics.com/circuitworks-tacky-flux-use-and-working-conditions-3\">Chemtronics CircuitWorks No-Clean Tacky Flux\u003C/a> is formulated for localized hot-air or iron rework and leaves a translucent amber/clear protective film. Qualifying your primary SMT paste alone does not qualify the multi-flux chemical mixture left after wave soldering or manual rework.\u003C/li>\n\u003Cli>\u003Cstrong>Why Unactivated Flux Is Dangerous:\u003C/strong> Weak organic acids (such as succinic, adipic, or glutaric acid) require sustained exposure to peak reflow temperatures (\u003Cspan class=\"math-inline\">215--245°C\u003C/span>) to thermally decompose or lock inside the cured resin matrix. If liquid flux flows under a cold component body or shielding can that never reaches activation temperature, hygroscopic acid activators remain free to absorb atmospheric moisture and form conductive ionic paths under DC bias.\u003C/li>\n\u003C/ul>\n\u003Ch2>2. Comparing the Four Engineering Process Routes\u003C/h2>\n\u003Cp>Selecting whether to \u003Cstrong>leave no-clean residue as-is\u003C/strong>, \u003Cstrong>wash the assembly\u003C/strong>, \u003Cstrong>conformal coat directly over residue\u003C/strong>, or \u003Cstrong>wash then coat\u003C/strong> requires matching the chemical stack to your product's electrical sensitivity, component standoff geometry, and environmental sealing requirements (\u003Ca href=\"/assets/blogs/no-clean-flux-residue/05-flux-decision.csv\">05-flux-decision.csv\u003C/a>):\u003C/p>\n\u003Ctable>\n\u003Cthead>\n\u003Ctr>\n\u003Cth>Process Route\u003C/th>\n\u003Cth>Target Hardware & Environment\u003C/th>\n\u003Cth>Interfacial & Chemical Mechanism\u003C/th>\n\u003Cth>Required Verification Evidence\u003C/th>\n\u003Cth>Critical Failure Mode (Hold Trigger)\u003C/th>\n\u003C/tr>\n\u003C/thead>\n\u003Ctbody>\u003Ctr>\n\u003Ctd>\u003Cstrong>1. Retain Residue (Uncoated)\u003C/strong>\u003C/td>\n\u003Ctd>Standard industrial/commercial enclosures; normal component standoff; no conformal coating\u003C/td>\n\u003Ctd>Polymerized rosin/resin matrix locks up ionic activators and repels ambient humidity\u003C/td>\n\u003Ctd>Flux TDS (\u003Ccode>ROL0\u003C/code>/\u003Ccode>REL0\u003C/code>); verified reflow profile; SIR/IC qualification on high-impedance nodes\u003C/td>\n\u003Ctd>Unactivated flux trapped under low-standoff QFN/RF shields, or unapproved bench rework flux added\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>\u003Cstrong>2. Wash No-Clean Residue (Uncoated)\u003C/strong>\u003C/td>\n\u003Ctd>High-frequency RF/mmWave, pA/nA high-impedance sensor front-ends, high-voltage creepage, or optical/cosmetic boards\u003C/td>\n\u003Ctd>Engineered saponifier or co-solvent dissolves cross-linked resin shell and flushes ionic core completely\u003C/td>\n\u003Ctd>Wash chemistry compatibility with specific resin; under-component penetration check (\u003Cspan class=\"math-inline\"><50 μm\u003C/span> gap); post-wash ROSE/IC/SIR\u003C/td>\n\u003Ctd>\u003Cstrong>Partial washing:\u003C/strong> weak wash dissolves outer resin shell and spreads active ionic core as conductive white residue\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>\u003Cstrong>3. Conformal Coat Over Residue\u003C/strong>\u003C/td>\n\u003Ctd>Harsh automotive/industrial environments requiring coating without aqueous wash equipment\u003C/td>\n\u003Ctd>Coating polymer must wet across low-surface-energy flux residue without dewetting or osmotic blistering (\u003Ca href=\"https://www.indium.com/blog/compatibility-of-conformal-coatings-versus-no-clean-solder-paste-flux-residues-when-to-clean/\">Indium coating study\u003C/a>)\u003C/td>\n\u003Ctd>Cross-vendor compatibility test (exact paste + rework flux + coating type); cross-hatch adhesion; damp-heat SIR\u003C/td>\n\u003Ctd>Coating retracts ("fisheyes" / dewetting) over solder fillets or blisters during temperature-humidity cycling\u003C/td>\n\u003C/tr>\n\u003Ctr>\n\u003Ctd>\u003Cstrong>4. Wash, Bake-Dry, Then Coat\u003C/strong>\u003C/td>\n\u003Ctd>High-reliability aerospace, medical, defense, EV traction, or potted outdoor assemblies\u003C/td>\n\u003Ctd>Stripping low-energy flux exposes high-surface-energy solder mask and metal for direct polymer bonding\u003C/td>\n\u003Ctd>Validated wash + DI rinse (\u003Cspan class=\"math-inline\">>10 MΩ·cm\u003C/span>) + pre-coat dehydration bake + coating thickness/adhesion check\u003C/td>\n\u003Ctd>Trapped rinse moisture or surfactant under QFN/BGA causes coating vesication (mealing) during cure\u003C/td>\n\u003C/tr>\n\u003C/tbody>\u003C/table>\n\u003Ch2>3. Three High-Risk Scenarios Where "No-Clean" Requires Special Engineering Control\u003C/h2>\n\u003Ch3>Scenario A: Low-Standoff Packages (QFN, LGA, DFN, Fine-Pitch BGA, RF Shields)\u003C/h3>\n\u003Cp>Modern bottom-terminated components (BTCs) such as QFNs, LGAs, and 0201/01005 passives sit only \u003Cstrong>\u003Cspan class=\"math-inline\">25--50 μm\u003C/span> (\u003Cspan class=\"math-inline\">1--2 mil\u003C/span>) above the PCB surface\u003C/strong>. During reflow, outgassing flux volatiles cannot easily escape from beneath a large QFN thermal pad or an unvented metal RF shield can, condensing as soft, unpolymerized flux pools bridging between the ground paddle and perimeter signal pins.\u003C/p>\n\u003Cul>\n\u003Cli>\u003Cstrong>If Retaining Residue:\u003C/strong> Use windowpane stencil segmentation (\u003Cspan class=\"math-inline\">50--70%\u003C/span> area) on thermal pads to reduce total flux volume and provide outgassing channels.\u003C/li>\n\u003Cli>\u003Cstrong>If Washing:\u003C/strong> Water alone cannot wash a no-clean resin, nor can low-pressure spray penetrate a \u003Cspan class=\"math-inline\">35 μm\u003C/span> gap. Specify an engineered aqueous saponifier or vapor-phase/co-solvent system with validated under-component impingement pressure, followed by destructive pry-off inspection during NPI to confirm zero trapped wash chemistry or white saponifier salts underneath the QFN body.\u003C/li>\n\u003C/ul>\n\u003Ch3>Scenario B: The Conformal Coating Interface (Surface Energy &Dewetting)\u003C/h3>\n\u003Cp>Applying acrylic, polyurethane, silicone, or parylene conformal coating directly over no-clean flux residue introduces a classic \u003Cstrong>surface-energy mismatch\u003C/strong>. As explained in \u003Ca href=\"https://www.chemtronics.com/conformal-coating-defects-when-things-go-horribly-wrong\">Chemtronics' analysis of conformal coating defects\u003C/a> and \u003Ca href=\"https://www.indium.com/blog/compatibility-of-conformal-coatings-versus-no-clean-solder-paste-flux-residues-when-to-clean/\">Indium's coating compatibility guidance\u003C/a>:\u003C/p>\n\u003Cul>\n\u003Cli>Liquid conformal coating will only wet smoothly across a surface if the \u003Cstrong>surface energy of the substrate (\u003Cspan class=\"math-inline\">γ\u003Csub>S\u003C/sub>\u003C/span>) is higher than the surface tension of the liquid coating (\u003Cspan class=\"math-inline\">γ\u003Csub>L\u003C/sub>\u003C/span>)\u003C/strong>.\u003C/li>\n\u003Cli>Many cured no-clean rosin/resin fillets—especially those modified with plasticizers or exposed to silicone mould-release agents—have a much lower surface energy than bare LPI solder mask. When sprayed, the liquid coating pulls back from the solder fillet (\u003Cstrong>dewetting / fisheyes\u003C/strong>), leaving the sharp metal component leads completely uncoated.\u003C/li>\n\u003Cli>Even if the coating initially bridges over a thick no-clean residue pocket, subsequent thermal cycling or damp heat (\u003Cspan class=\"math-inline\">85°C / 85% RH\u003C/span>) draws water vapor through the semi-permeable coating into the hygroscopic flux residue underneath, creating \u003Cstrong>osmotic blisters (mealing)\u003C/strong> that lift the coating off the PCB.\u003C/li>\n\u003C/ul>\n\u003Ch3>Scenario C: Hand-Solder Touch-Up and Spot-Cleaning Mistakes\u003C/h3>\n\u003Cp>The single most frequent cause of field corrosion and coating delamination on "no-clean" boards is \u003Cstrong>uncontrolled bench rework\u003C/strong>. Consider an assembly whose primary SMT paste was fully qualified for Route 3 (coat over residue):\u003C/p>\n\u003Col>\n\u003Cli>After ICT/AOI, a technician touches up a connector or replaces a QFP using a cored wire solder or a syringe of tacky rework flux from a different vendor.\u003C/li>\n\u003Cli>Because a manual soldering iron heats only the single pin for \u003Cspan class=\"math-inline\">3--5 seconds\u003C/span>, excess flux flows onto adjacent cold solder mask without ever experiencing full reflow thermal deactivation.\u003C/li>\n\u003Cli>Even worse, if the operator wipes the sticky spot with a cotton swab dipped in ordinary isopropyl alcohol (IPA) or \u003Cstrong>conformal coating thinner\u003C/strong> (\u003Ca href=\"https://www.chemtronics.com/conformal-coating-defects-when-things-go-horribly-wrong\">Chemtronics coating defect warning\u003C/a>), the solvent partially dissolves the resin matrix and smears a thin, invisible layer of active ionic halides across the surrounding fine-pitch pads—causing immediate coating retraction or dendritic shorting in humid service.\u003C/li>\n\u003C/ol>\n\u003Cp>\u003Cstrong>Engineering Rule for Rework:\u003C/strong> Lock the permitted rework flux in the assembly BOM alongside the primary solder paste (see our \u003Ca href=\"/it/blog/solder-paste/\">solder paste selection guide\u003C/a>). If localized spot-cleaning is performed after rework, use a matched flux remover explicitly validated for that flux chemistry, blot/flush away the dissolved residue completely rather than smearing it, and re-verify cleanliness before conformal coating.\u003C/p>\n\u003Ch2>4. Evaluating Supplier Quotes and Specifying Cleanliness in Your PCBA RFQ\u003C/h2>\n\u003Cp>When comparing PCBA quotations from two contract manufacturers, a lower unit price often assumes \u003Cstrong>Route 1 (unwashed, uncoated no-clean)\u003C/strong> with zero ionic cleanliness testing, whereas a higher quote includes inline aqueous saponifier washing, DI water rinse monitoring, pre-coat baking, and lot-level cleanliness certification. Normalize the process scope in your \u003Ca href=\"/it/products/pcb-assembly/\">PCB assembly\u003C/a> RFQ by specifying:\u003C/p>\n\u003Col>\n\u003Cli>\u003Cstrong>Selected Residue & Coating Route:\u003C/strong> State explicitly whether the build is \u003Cem>No-Clean Retained (Uncoated)\u003C/em>, \u003Cem>No-Clean Washed (Uncoated)\u003C/em>, \u003Cem>Conformal Coated Over Qualified No-Clean\u003C/em>, or \u003Cem>Washed + Baked + Conformal Coated\u003C/em>.\u003C/li>\n\u003Cli>\u003Cstrong>Locked Flux & Paste Chemistry:\u003C/strong> Require the assembler to declare the exact SMT solder paste, wave/selective liquid flux, and rework flux/wire part numbers (and J-STD-004 classifications) before first-article build, prohibiting unapproved substitutions.\u003C/li>\n\u003Cli>\u003Cstrong>Cleanliness & Interface Verification Gate:\u003C/strong> Where washing or high-reliability qualification applies, specify the acceptance standard and test method—such as \u003Cstrong>ionic contamination \u003Cspan class=\"math-inline\">≤ 1.56 μg/cm\u003Csup>2\u003C/sup>\u003C/span> NaCl equivalent\u003C/strong> via ROSE (IPC-TM-650 2.3.25), Ion Chromatography (2.3.28) for specific weak organic acids/halides, or SIR (2.6.3.7)—plus cross-hatch adhesion testing (IPC-TM-650 2.4.1) for coated boards.\u003C/li>\n\u003Cli>\u003Cstrong>Downloadable Decision Matrix:\u003C/strong> Attach \u003Ca href=\"/assets/blogs/no-clean-flux-residue/05-flux-decision.csv\">05-flux-decision.csv\u003C/a> to align design, quality, and manufacturing engineers on the exact verification gate for your assembly.\u003C/li>\n\u003C/ol>\n\u003Cp>HILPCB's \u003Ca href=\"/it/products/pcb-assembly/\">PCB assembly\u003C/a> and \u003Ca href=\"/it/products/smt-assembly/\">SMT assembly\u003C/a> operations maintain strict BOM-locked solder paste and rework-flux controls, multi-zone reflow profiling, automated wash/rinse/dry lines for cleaned assemblies, and ionic contamination verification (\u003Cstrong>held \u003Cspan class=\"math-inline\">≤ 1.56 μg/cm\u003Csup>2\u003C/sup>\u003C/span> NaCl equivalent\u003C/strong> on qualified builds). Upload your Gerber, BOM, and coating/cleanliness specifications when you \u003Ca href=\"/it/quote/\">request a quote\u003C/a> so our process engineers can lock the right flux and validation route for your hardware.\u003C/p>\n\u003Cdiv data-component=\"BlogQuickQuoteInline\">\u003C/div>\n\n\u003C!-- faq:start -->\n\u003Ch2>Frequently Asked Questions\u003C/h2>\n\u003Ch3>Why is it often harder to wash off "no-clean" flux residue than water-soluble flux?\u003C/h3>\n\u003Cp>Water-soluble (\u003Ccode>OA\u003C/code>) fluxes are chemically designed to dissolve rapidly in plain deionized (DI) water, and \u003Cstrong>must\u003C/strong> be washed immediately because their residues are highly corrosive. No-clean (\u003Ccode>ROL0\u003C/code>/\u003Ccode>REL0\u003C/code>) fluxes are formulated with hydrophobic rosins and synthetic resins designed to resist moisture in service; washing them requires heated chemical saponifiers or engineered co-solvents capable of breaking down the polymerized resin shell without leaving insoluble white metal-soap precipitates.\u003C/p>\n\u003Ch3>Is wiping no-clean flux residue with a brush and 99% IPA sufficient before conformal coating?\u003C/h3>\n\u003Cp>Often no—especially on modern synthetic no-clean pastes and tacky rework fluxes. Room-temperature manual wiping with IPA frequently dissolves only the outer resin surface and smears a thin, tacky film across the surrounding solder mask and pads, which reduces surface energy and triggers conformal coating dewetting or mealing. Always use a validated wash process or a flux remover matched to the specific flux TDS, followed by complete removal/rinsing of the dissolved soils.\u003C/p>\n\u003Ch3>What causes white powdery or crystalline residue after cleaning a no-clean PCBA?\u003C/h3>\n\u003Cp>White residue typically indicates \u003Cstrong>incomplete saponification or premature rinsing\u003C/strong>: either the wash chemical concentration/temperature was too low to fully dissolve the polymerized rosin/resin, the flux was over-oxidized by an excessive reflow profile, or the dissolved resin precipitated back out of solution when hit by cold DI rinse water.\u003C/p>\n\u003Ch3>When is leaving no-clean flux residue unwashed the better engineering choice?\u003C/h3>\n\u003Cp>When your assembly operates in a controlled environment without conformal coating, uses components that cannot tolerate aqueous immersion or ultrasonic washing (such as unsealed MEMS microphones, Buzzers, relays, optical sensors, or batteries), and uses a locked \u003Ccode>ROL0\u003C/code> paste + reflow profile with verified SIR performance, retaining the intact no-clean residue avoids the risk of trapping wash water or partially dissolved ionic residues underneath low-standoff packages.\u003C/p>\n\u003C!-- faq:end -->\n\u003Csection class=\"related-links\" aria-label=\"Link correlati\">\u003Ch3 id=\"related-links\">Link correlati\u003C/h3>\u003Cul>\u003Cli>\u003Ca href=\"/it/blog/cleanliness-testing-pcb-manufacturing-quality/\">Test di Pulizia dei PCB: Guida a ROSE, Gascromatografia Ionica, SIR e RFQ\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/assets/blogs/no-clean-flux-residue/05-flux-decision.csv\">05-flux-decision.csv\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/it/blog/solder-paste/\">Cos'è la pasta saldante? Composizione chimica, leghe SAC305 vs piombo e processi SMT\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/it/products/pcb-assembly/\">PCB assembly\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/it/products/smt-assembly/\">SMT assembly\u003C/a>\u003C/li>\u003Cli>\u003Ca href=\"/it/quote/\">request a quote\u003C/a>\u003C/li>\u003C/ul>\u003C/section>",[14,18,21,25],{"question":15,"answer":16,"answerText":17},"Why is it often harder to wash off \"no-clean\" flux residue than water-soluble flux?","Water-soluble (`OA`) fluxes are chemically designed to dissolve rapidly in plain deionized (DI) water, and **must** be washed immediately because their residues are highly corrosive. No-clean (`ROL0`/`REL0`) fluxes are formulated with hydrophobic rosins and synthetic resins designed to resist moisture in service; washing them requires heated chemical saponifiers or engineered co-solvents capable of breaking down the polymerized resin shell without leaving insoluble white metal-soap precipitates.","Water-soluble (OA) fluxes are chemically designed to dissolve rapidly in plain deionized (DI) water, and must be washed immediately because their residues are highly corrosive. No-clean (ROL0/REL0) fluxes are formulated with hydrophobic rosins and synthetic resins designed to resist moisture in service; washing them requires heated chemical saponifiers or engineered co-solvents capable of breaking down the polymerized resin shell without leaving insoluble white metal-soap precipitates.",{"question":19,"answer":20,"answerText":20},"Is wiping no-clean flux residue with a brush and 99% IPA sufficient before conformal coating?","Often no—especially on modern synthetic no-clean pastes and tacky rework fluxes. Room-temperature manual wiping with IPA frequently dissolves only the outer resin surface and smears a thin, tacky film across the surrounding solder mask and pads, which reduces surface energy and triggers conformal coating dewetting or mealing. Always use a validated wash process or a flux remover matched to the specific flux TDS, followed by complete removal/rinsing of the dissolved soils.",{"question":22,"answer":23,"answerText":24},"What causes white powdery or crystalline residue after cleaning a no-clean PCBA?","White residue typically indicates **incomplete saponification or premature rinsing**: either the wash chemical concentration/temperature was too low to fully dissolve the polymerized rosin/resin, the flux was over-oxidized by an excessive reflow profile, or the dissolved resin precipitated back out of solution when hit by cold DI rinse water.","White residue typically indicates incomplete saponification or premature rinsing: either the wash chemical concentration/temperature was too low to fully dissolve the polymerized rosin/resin, the flux was over-oxidized by an excessive reflow profile, or the dissolved resin precipitated back out of solution when hit by cold DI rinse water.",{"question":26,"answer":27,"answerText":28},"When is leaving no-clean flux residue unwashed the better engineering choice?","When your assembly operates in a controlled environment without conformal coating, uses components that cannot tolerate aqueous immersion or ultrasonic washing (such as unsealed MEMS microphones, Buzzers, relays, optical sensors, or batteries), and uses a locked `ROL0` paste + reflow profile with verified SIR performance, retaining the intact no-clean residue avoids the risk of trapping wash water or partially dissolved ionic residues underneath low-standoff packages.","When your assembly operates in a controlled environment without conformal coating, uses components that cannot tolerate aqueous immersion or ultrasonic washing (such as unsealed MEMS microphones, Buzzers, relays, optical sensors, or batteries), and uses a locked ROL0 paste + reflow profile with verified SIR performance, retaining the intact no-clean residue avoids the risk of trapping wash water or partially dissolved ionic residues underneath low-standoff packages.",[30,31,32,33],"no clean flux","flux residue","PCBA cleaning","conformal coating","no-clean-flux-residue","en",[35,37,38,39,40],"de","cn","fr","ru",{"blog":42,"breadcrumb":51},{"@context":43,"@type":44,"headline":4,"description":5,"image":8,"url":45,"datePublished":6,"dateModified":6,"timeRequired":11,"keywords":46,"articleSection":7,"author":47,"publisher":50},"https://schema.org","BlogPosting","https://hilpcb.com/it/blog/no-clean-flux-residue/","no clean flux, flux residue, PCBA cleaning, conformal coating",{"@type":48,"name":49},"Organization","HILPCB",{"@type":48,"name":49},{"@context":43,"@type":52,"itemListElement":53},"BreadcrumbList",[54,59,63],{"@type":55,"position":56,"name":57,"item":58},"ListItem",1,"Home","https://hilpcb.com/",{"@type":55,"position":60,"name":61,"item":62},2,"Blog","https://hilpcb.com/it/blog/",{"@type":55,"position":64,"name":34,"item":45},3,1793497495513]