Professional PCB Manufacturing Services
Advanced manufacturing capabilities for rigid PCB, flexible PCB, HDI PCB, RF PCB, rigid-flex PCB, and metal core PCB with industry-leading precision. Comprehensive material support including FR4, Rogers, polyimide, and aluminum substrates.
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Complete PCB Manufacturing Solutions
Our manufacturing facility specializes in producing comprehensive PCB types with advanced material capabilities. From standard applications to specialized requirements, we deliver precision manufacturing across diverse substrate materials.
Rigid PCB
Professional rigid PCB manufacturing from single layer to 64-layer multilayer configurations with FR4 and high-frequency materials.
Key Specifications
- 1-64 layers capability
- 0.2-10mm thickness range
- FR4, Rogers, ceramic materials
- ±5% impedance control
Flexible PCB
Advanced flexible PCB manufacturing using polyimide and specialty materials with superior bend reliability for dynamic applications.
Key Specifications
- Polyimide and PET substrates
- 1-16 flexible layers
- 0.1-1.0mm thickness
- Dynamic bend capability
HDI PCB
High-density interconnect PCBs with advanced microvia technology for complex, miniaturized electronic devices requiring high component density.
Key Specifications
- Microvia & buried via technology
- 2/2mil line width/spacing
- Sequential lamination process
- Stacked & staggered vias
RF PCB
Specialized high-frequency PCBs using premium materials with precise impedance control for optimal signal integrity in wireless applications.
Key Specifications
- Rogers, Taconic, Arlon materials
- Precise impedance control ±5%
- Frequencies up to 77GHz
- Hybrid material stackups
Rigid-Flex PCB
Integrated rigid and flexible circuit boards that combine the benefits of both technologies for applications requiring reliability in dynamic environments.
Key Specifications
- Up to 20 rigid-flex layers
- Dynamic flex zones
- 3D packaging capability
- Reduced connector requirements
Metal Core PCB
Thermal management PCBs with aluminum or copper core for efficient heat dissipation in high-power applications like LED lighting and power converters.
Key Specifications
- Aluminum or copper base material
- 1-4 layer configurations
- Thermal conductivity up to 380W/m·K
- Dielectric thickness 50μm-10mil
Advanced Manufacturing Processes
Our facility operates two specialized manufacturing processes engineered to deliver exceptional precision. The positive process achieves industry-leading 2/2mil capabilities, while our negative process provides reliable 3/3mil precision.
Ultra-Fine Line Production
Advanced alkaline etching with photoresist tenting technology delivers industry-leading precision for high-density interconnect applications.
Standard PCB Manufacturing
Proven acid etching with advanced dry film methodology delivers reliable precision for standard applications and power electronics.
Technical Excellence
Our advanced manufacturing capabilities ensure optimal solutions for every application.
| Feature | Industry Standard | Advanced Manufacturing | Our Capability |
|---|---|---|---|
| Min. Line Width/Spacing | 3/3mil (75/75μm) | 2/2mil (50/50μm) | 2/2mil (50/50μm) |
| Max. Layers | 4-40 layers | 1-30 layers | Up to 64 layers |
| Board Thickness Range (mm) | 0.4-6.0mm | 0.6-8.0mm | 0.2-10.0mm |
| Min. Hole Size (mm) | 0.1mm (4mil) | 0.15mm (6mil) | 0.075mm (3mil) |
| Copper Weight (oz) | 0.5-4oz | 1-6oz | Up to 20oz |
| Impedance Control | ±5% | ±10% | ±5% |
| Standard Lead Time (Days) | 5-8 days (expedite available) | 3-5 days (incl. 48-hour expedite) | 24-hour expedite available |
Quality Management & Certifications
Our manufacturing excellence is verified through comprehensive quality certifications and rigorous testing protocols, ensuring consistent reliability for critical applications.
ISO 9001:2015
International quality management system certification ensuring continuous improvement and consistent manufacturing excellence.
ISO 13485:2016
Medical device quality management certification covering healthcare and life sciences electronics production.
IATF 16949:2016
Automotive industry quality management standard for safety-critical and high-reliability electronics manufacturing.
AS9100D
Aerospace and defense quality management certification for mission-critical aviation and space applications.
IPC-A-610 Class 3
Highest reliability acceptance standard for electronic assemblies in space, military, and medical devices.
RoHS Compliance
Restriction of Hazardous Substances compliance ensuring environmentally safe electronic products.
UL Certification
Underwriters Laboratories safety certification with full material traceability and registered E-file.
REACH Compliance
European Union REACH regulation compliance guaranteeing responsible chemical usage and environmental protection.
IPC-6012 Class 3
Rigid PCB qualification and performance specification for high-reliability applications.
J-STD-001
Requirements for soldered electrical and electronic assemblies with the highest workmanship standards.
Partner with Manufacturing Excellence
Experience precision and reliability trusted by industry leaders. Our engineering team provides comprehensive design for manufacturability analysis and process optimization recommendations.