Pedestrian Detection PCB: The Automotive Electronics Core Guarding Road Safety

technologySeptember 29, 2025 14 min read

Pedestrian Detection PCBAutonomous Driving PCBCollision Avoidance PCBLane Detection PCBTraffic Sign Recognition PCBComputer Vision PCB

Pedestrian Detection PCB: The Core Automotive Electronic for Safeguarding Road Safety

In today's rapidly advancing landscape of Advanced Driver-Assistance Systems (ADAS) and autonomous driving technologies, the Pedestrian Detection PCB has become a critical technological cornerstone for ensuring road safety, especially for protecting vulnerable road users. This seemingly ordinary circuit board bears the arduous task of processing vast amounts of data from sensors such as cameras, millimeter-wave radar, and lidar, and making life-critical decisions within milliseconds. As a safety expert deeply rooted in the field of automotive electronics, I understand that its design and manufacturing complexity far exceed that of consumer-grade electronics. It must not only meet the ISO 26262 functional safety standard but also pass the stringent tests of the IATF 16949 quality management system and ensure full lifecycle reliability under the AEC-Q certification framework. Highleap PCB Factory (HILPCB), with years of experience in automotive-grade manufacturing, is committed to providing global automotive manufacturers with Pedestrian Detection PCB solutions that comply with the highest safety and quality standards.

ISO 26262 Functional Safety: The Lifeline of Pedestrian Detection PCB

Functional safety is the paramount principle in automotive electronics, and this is especially true for pedestrian detection systems, which directly relate to human safety. Even a minor electronic failure can lead to catastrophic consequences. Therefore, the design of Pedestrian Detection PCB must strictly adhere to the ISO 26262 standard from the outset.

This standard defines Automotive Safety Integrity Levels (ASIL), ranging from A to D, with higher levels indicating stricter requirements. Pedestrian detection systems typically require ASIL B or ASIL C levels. This means the PCB design must integrate a series of safety mechanisms to prevent and control random hardware failures and systematic failures.

Key design considerations include:

Redundancy Design: Employing dual or multi-path redundant designs in critical signal paths or power networks to ensure that the system can maintain basic safety functions or enter a safe state even if a single path fails.
Fault Diagnosis and Reporting: The PCB must integrate diagnostic circuits capable of real-time monitoring of the operational status of critical components (e.g., processors, power management chips). Once an anomaly is detected, the Diagnostic Coverage must meet the ASIL level requirements and be able to report the fault to the upper-level controller via the in-vehicle communication network (e.g., CAN bus).
Fail-Safe Mechanism: When the system detects a severe, uncorrectable fault, the PCB design must ensure that the system can safely shut down or switch to a predefined safe mode, avoiding uncontrolled dangerous behavior. This is a fundamental requirement for all Collision Avoidance PCB.

HILPCB deeply understands the importance of functional safety for automotive PCBs. Our engineering team works closely with clients during the design review phase to ensure that PCB layout, component selection, and electrical performance fully meet the requirements of the target ASIL level.

ASIL Safety Level Requirements Matrix

The ISO 26262 standard defines different Automotive Safety Integrity Levels (ASIL) based on risk severity, exposure probability, and controllability. Higher levels impose stricter requirements on hardware failure rates and safety mechanisms.

Requirements	ASIL A	ASIL B	ASIL C	ASIL D
Single-Point Fault Metric (SPFM)	≥ 90%	≥ 90%	≥ 97%	≥ 99%
Latent Fault Metric (LFM)	≥ 60%	≥ 80%	≥ 90%	≥ 90%
Hardware Random Failure Target Value (FIT)	< 1000	< 100	< 100	<> 10

* FIT: Failures In Time, number of failures per billion hours.

Reliability in Harsh Environments: Automotive-Grade Materials and Design Considerations

The automotive working environment is one of the most challenging for all electronic devices. From the extreme cold of Siberia to the intense heat of the Sahara, from bumpy unpaved roads to high-humidity coastal areas, the Pedestrian Detection PCB must maintain stable operation across a wide temperature range of -40°C to 125°C, enduring strong mechanical vibrations and humidity shocks.

To meet these challenges, material selection and structural design are crucial:

High Tg Substrate: Automotive PCBs commonly use substrates with a glass transition temperature (Tg) higher than 170°C. A high Tg value means the circuit board has better dimensional stability and mechanical strength at high temperatures, effectively preventing delamination and warping. HILPCB's High Tg PCB is an ideal choice for automotive electronic applications.
Low CTE Materials: Mismatched coefficients of thermal expansion (CTE) are a primary cause of solder joint fatigue and via cracking. Choosing substrates with CTE values similar to electronic components can significantly improve PCB reliability under thermal cycling stress.
CAF Resistance: Conductive Anodic Filament (CAF) is a potential failure mode for PCBs in high-temperature and high-humidity environments, which can lead to internal short circuits. HILPCB uses high-quality glass fabric and resin systems, and optimizes drilling processes to ensure excellent CAF resistance.
Thick Copper Design: To carry high currents and improve heat dissipation, the power sections in ADAS systems often require the use of Heavy Copper PCB. Thickened copper foil not only reduces circuit temperature rise but also enhances the mechanical strength of the circuit board.

These seemingly basic choices collectively form the cornerstone of Autonomous Driving PCB reliability, ensuring stable operation throughout a vehicle's lifespan of 15 years or more.

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High-Speed Signal Integrity: Ensuring Precise Sensor Data Transmission

Pedestrian detection systems rely on high-resolution cameras, radar, and other sensors, which generate extremely high data stream rates. For example, a high-definition camera's data rate can reach several Gbps. One of the core tasks of the Pedestrian Detection PCB is to ensure that these high-speed signals can be transmitted losslessly and accurately from the interface to the main processor.

Challenges to signal integrity (SI) include:

Impedance Control: High-speed signal transmission lines must have precise characteristic impedance (typically 50Ω single-ended or 100Ω differential). Any impedance mismatch will lead to signal reflection, disrupting data integrity.
Differential Pair Routing: Differential signal pairs (such as MIPI, LVDS) must be routed with strict equal length and spacing to maximize common-mode noise suppression.
Crosstalk and EMI: High-density routing makes crosstalk easily occur between adjacent signal lines. PCB design needs to control electromagnetic interference (EMI) through reasonable routing spacing, reference plane design, and shielding techniques. To address these challenges, HILPCB adopts advanced high-speed PCB manufacturing processes and simulation tools. We use low-loss substrates and utilize electromagnetic field simulation software to predict and optimize signal integrity already at the design stage. Whether it's Lane Detection PCB or Traffic Sign Recognition PCB, they all share a common need for high-speed data processing, and excellent signal integrity is fundamental to realizing their functionality. For more complex Computer Vision PCBs, High-Density Interconnect (HDI) technology, such as HDI PCB, is also often used to achieve complex routing in limited space.

Automotive Electronics Environmental Test Standards (AEC-Q100/200 Excerpt)

Automotive-grade PCBs and their components must pass a series of stringent environmental and reliability tests to simulate the extreme conditions they might encounter throughout the vehicle's lifecycle.

Test Item	Test Conditions	Purpose
Temperature Cycling (TC)	-40°C ↔ +125°C, 1000 cycles	Evaluates failure due to thermal expansion mismatch of materials
High-Temperature Storage Life (HTSL)	+150°C, 1000 hours	Evaluates long-term stability of materials at high temperatures
Mechanical Shock and Vibration

Multi-axis random vibration, simulating road conditions Evaluate PCB mechanical strength and solder joint reliability Temperature-Humidity Bias (THB) 85°C / 85% RH, 1000 hours, biased Evaluate electrochemical migration risk in humid and hot environments

Electromagnetic Compatibility (EMC): The "Invisible Shield" in Complex Electromagnetic Environments

Modern cars are filled with various electronic devices, from engine control units to infotainment systems, forming an extremely complex electromagnetic environment. A Pedestrian Detection PCB must operate stably in this environment, neither interfering with other devices (electromagnetic emission) nor being interfered with by other devices (electromagnetic immunity).

EMC design is systems engineering, and the PCB is a core component. Excellent EMC design strategies include:

Multi-layer boards and grounding design: Using multi-layer board design with complete ground planes and power planes to provide low-impedance return paths for high-speed signals is fundamental to controlling EMI.
Power Integrity (PI): By placing a sufficient number and capacitance of decoupling capacitors near power entry points and critical chips, the stability of the power network is ensured, preventing noise coupling through the power network.
Partitioning and shielding: Physically isolating different functional areas on the PCB (e.g., analog, digital, power, RF) and using shielding covers when necessary to prevent mutual interference.

A poorly designed Collision Avoidance PCB might be interfered with, misjudge, or fail at a critical moment, with unimaginable consequences. HILPCB's engineering team follows strict EMC design rules and utilizes simulation tools for pre-analysis, helping customers mitigate potential EMC risks early in the design phase.

HILPCB's Automotive-Grade Manufacturing: From Design to Reliable Product

Even the most perfect theoretical design requires excellent manufacturing capabilities to become a reality. As an IATF 16949 certified automotive-grade PCB manufacturer, HILPCB integrates the "zero defect" philosophy into every step of production. We understand how a high-quality Autonomous Driving PCB is manufactured.

Our automotive-grade manufacturing system includes:

Dedicated production lines: Establishing independent production lines for automotive customers, employing stricter process control parameters and quality inspection standards.
Strict Incoming Quality Control (IQC): All raw materials used for automotive PCBs, from substrates to chemical solutions, must come from certified suppliers and undergo stringent inspection.
Advanced Process Control (APC): For critical processes such as image transfer, lamination, drilling, and plating, we employ Statistical Process Control (SPC) methods to real-time monitor the process capability index (Cpk) and ensure stable process windows.
100% Automated Optical Inspection (AOI) and electrical testing: Every automotive PCB leaving the factory undergoes multiple AOI checks and high-voltage electrical tests to ensure no open circuits, short circuits, or any minor line defects. Choosing HILPCB means you are partnering with a company that deeply understands the quality requirements of the automotive industry. We don't just produce circuit boards; we provide quality assurance for your critical products like Lane Detection PCB and Traffic Sign Recognition PCB.

HILPCB Automotive-Grade Manufacturing Certifications

Our manufacturing capabilities and quality management system have gained widespread recognition in the automotive industry, ensuring that we provide customers with products that meet the highest standards.

IATF 16949:2016 Certification: The global automotive industry quality management standard set by the International Automotive Task Force (IATF), an essential qualification for entering the automotive supply chain.
ISO 9001:2015 Certification: The internationally recognized quality management system standard, forming the foundation for all our production activities.
VDA 6.3 Process Audit Capability: Possessing the ability to accept and meet the strict process audit requirements of the German Association of the Automotive Industry (VDA), trusted by European customers.
AEC-Q Certification Support: Our PCB products can meet and support customers in obtaining end-product certifications such as AEC-Q100 (integrated circuits) and AEC-Q200 (passive components).
PPAP (Production Part Approval Process): Capable of providing customers with a complete PPAP documentation package, including design records, FMEA, control plans, MSA, and dimension/performance test reports.

Complete Traceability: The Quality Chain from Raw Materials to Finished Products

In the automotive industry, if a quality issue arises, it is crucial to quickly locate the problematic batch and implement a recall. Therefore, complete traceability is a mandatory requirement. HILPCB has established a full-process traceability system.

Every Pedestrian Detection PCB is assigned a unique QR code or serial number upon production. Through this ID, we can trace back to:

Raw Material Information: Supplier, batch, and production date of the substrate, copper foil, and PP sheets used.
Production Process Data: Production equipment, operators, process parameters, and timestamps at each critical operation.
Quality Inspection Records: Raw data and results from all stages, including AOI, electrical testing, dimensional measurement, and reliability testing.

This detailed traceability capability not only meets the requirements of IATF 16949 but is also our solemn commitment to our customers. It ensures that whenever any quality issue related to Computer Vision PCB arises, we can respond quickly, conduct effective root cause analysis, and minimize the scope of impact.

Beyond PCBs: HILPCB's Automotive-Grade PCBA Services

A reliable PCB is fundamental, but it's the high-quality PCBA (Printed Circuit Board Assembly) that ultimately determines ECU performance. HILPCB offers one-stop turnkey assembly services, extending our automotive-grade manufacturing advantages to the assembly field.

Our automotive-grade PCBA services include:

Automotive-grade Component Procurement: Leveraging our strong supply chain network, we procure AEC-Q compliant components exclusively from authorized distributors, eliminating the risk of counterfeit or inferior devices.
High-Reliability Soldering Process: We utilize advanced SMT production lines and selective wave soldering equipment, developing optimized soldering temperature profiles for complex packages commonly used in automotive products, such as BGA and QFN, to ensure the long-term reliability of solder joints.
Rigorous Cleaning and Coating: Assembled PCBAs undergo a strict cleaning process to remove residues that could cause electrochemical migration. Additionally, conformal coating is applied as per customer requirements to enhance moisture and corrosion resistance.
Comprehensive Testing Strategy: We offer multi-level testing solutions, including In-Circuit Test (ICT), Functional Test (FCT), and aging test, ensuring that every PCBA shipped meets 100% of the design functions and performance indicators.

Whether for Collision Avoidance PCB or other ADAS modules, HILPCB's assembly services ensure your design intent is perfectly realized, accelerating the product's time-to-market.

HILPCB Automotive-Grade Assembly Capability Matrix

We provide comprehensive Electronic Control Unit (ECU) assembly services for automotive applications, covering the entire process from component procurement to final functional testing, ensuring the highest reliability and quality.

Service Item	Capability Details	Value to Customer
Component Procurement	Procurement of AEC-Q100/200 certified devices exclusively from authorized channels	Eliminates the risk of counterfeit and inferior products, ensuring component reliability
SMT Placement Capability	01005 components, 0.35mm pitch BGA/QFN, high-precision POP	Meets the assembly requirements for high-density, complex chips such as ADAS processors.
Soldering Process	Lead-free/leaded process, nitrogen reflow soldering, selective wave soldering	Provides highly reliable solder joints, meeting automotive vibration and thermal cycling requirements.
Testing & Inspection	3D AOI, 3D X-Ray, ICT, FCT, Aging Test	Comprehensive coverage, ensuring zero defects in ex-factory products.
Conformal Coating	Selective automatic coating, compliant with IPC-A-610 standard	Enhances PCBA protection against moisture, salt spray, and chemical corrosion.

Conclusion: Choose a Professional Partner, Create a Safe Future Together

Pedestrian Detection PCB is an indispensable part of modern automotive safety systems, and every detail of its design and manufacturing is closely related to life safety. It requires suppliers not only to have advanced technology and equipment but also a deep understanding and reverence for the automotive industry's safety culture and quality systems. From meeting ISO 26262 functional safety and addressing harsh environmental challenges to ensuring high-speed signal integrity and electromagnetic compatibility, every link is full of challenges.

HILPCB, with its many years of deep cultivation in the automotive electronics field, has established a complete service chain from PCB design support, automotive-grade manufacturing, to highly reliable assembly. We have passed IATF 16949 certification and strictly follow AEC-Q standards, committed to becoming your most trusted partner. Choosing HILPCB means choosing safety, reliability, and professionalism. Let's work together to contribute to building safer Pedestrian Detection PCBs and future intelligent driving.