HilPCB Technology Blog

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TechnologySeptember 4, 2025
First Article Inspection (FAI)Fixture design (ICT/FCT)Boundary-Scan/JTAG+3

First Article Inspection (FAI): Mastering Photoelectric Coordination and Thermal Power Challenges in Data Center Optical Module PCBs

An in-depth analysis of the core technologies of First Article Inspection (FAI), covering high-speed signal integrity, thermal management, and power/interconnect design to help you build high-performance data center optical module PCBs.